Used HAKUTO HAP 3510C #156190 for sale

HAKUTO HAP 3510C is an exposure equipment designed for wafer-level manufacturing processes. This system provides the precision and accuracy necessary for fine pitch devices. The exposure head accommodates a variety of mask sizes, including quartz masks, and its exposure window is compatible with medium- to large-scale production requirements. The high-precision stage movement also ensures accurate and consistent exposure results. HAP 3510C is a direct exposure unit which is capable of exposing quartz masks up to 8 inches in size. It utilizes a patented exposure head which moves across the entire wafer in a "scanning" motion, allowing for higher exposure uniformity and exposure accuracy. The exposure head has a special shutter design which minimizes flare and enables more precise exposure resolution. HAKUTO HAP 3510C can be used for exposure of up to 100nm fine pitch devices. With its advanced motion control algorithms, the exposure head can move smoothly and accurately at a speed of up to 6000mm per hour, ensuring quick and reliable exposure results. The exposure machine also features an advanced cooling tool, allowing it to maintain the required thermal environment for optimal results. The exposure asset can be integrated with a variety of machine tools and processes to meet your automated production requirements. This model features easy-to-use computer controls with a graphical interface, enabling users to optimize operations quickly. It also features a highly automated fault-tolerant design, which maximizes equipment up-time and supports reliable, long-term production. Apart from its various features, HAP 3510C also offers a range of safety features. These include dust protection for the wafer, wafer alignment and misalignment detection, and an auto safety shut-off system. Additionally, the unit is based on an open architecture, making it scalable and customizable. HAKUTO HAP 3510C is an all-around exposure machine, able to provide efficient exposure solutions for your wafer-level processes. Its reliable exposure results, combined with its high accuracy, make it the ideal choice for wafer-level processing.