Used OVAC OV29 #82531 for sale

OVAC OV29 is an exposure equipment designed for use in the semiconductor industry for the production of high-performance ICs. It is used to deposit uniform layers of high-precision process materials onto wafers in the manufacture of semiconductor devices. OV29 enables the uniform layer deposition to occur at high deposition rates and with excellent step coverage for a range of materials, including dielectrics, metals, polymers, and oxides. OVAC OV29 is comprised of an integrated vacuum chamber, dual ion source process chambers, and a heated chamber. The integrated vacuum chamber helps maintain a high level of process control and good vacuum performance throughout the deposition process. The gases used in the process can be pumped through one of the two process chambers to either the source-side or substrate-side. Both of these chambers feature high source-to-substrate distance capabilities, helping to provide excellent step coverage. Furthermore, the heated chamber included with the system is suitable for the deposition of thicker and denser layers, such as high-k dielectrics. OV29 offers excellent adhesion and uniformity through the use of improved line-of-sight technology. This provides complete coverage of the substrate, regardless of wafer geometry, thus ensuring that there are no gaps. The unit also features a multi-process chamber that can be used to accurately deposit multiple layers simultaneously. This ensures that the most complicated devices can be produced in an efficient and cost-effective manner. OVAC OV29 is compatible with both standard and bonded wafers, and is also capable of handling a variety of other substrates, including silicon, gallium arsenide, and glass. In addition, the machine's uniform layer deposition enables the use of advanced metrology methods, such as atomic force microscopy (AFM), to monitor the progress of each process step. This provides real-time feedback and can be used to adjust process parameters as needed. OV29 is a versatile and reliable process solution designed for the most challenging applications. In combination with its superior performance, uniform layer deposition, and multi-process capabilities, the tool is an ideal option for the successful production of high-performance ICs.