Used USHIO CE-6000CH #9372470 for sale

USHIO CE-6000CH
Manufacturer
USHIO
Model
CE-6000CH
ID: 9372470
Vintage: 2005
UV cure oven, 2005 vintage.
USHIO CE-6000CH is a digital exposure equipment designed to serve and support the electronics, photonics, packaging, micro- manufacturing, and other printed circuit, and thin film technology sectors. This machine helps to create and maintain accurate and precise dimensions and shapes for a variety of thin film layer materials and packages in the development of both basic and advanced components. CE-6000CH features a 6-axis linear motor drive design, providing for high resolution and speed, and enabling the machine to operate in challenging environments without degrading performance. The system also features a linear magnetic field that moves uniformly throughout the work envelope, providing precise and repeatable operation. USHIO CE-6000CH also offers a large and easy-to-use 12.1¿ LCD control panel with full-color display options, automatic motorized wafer change-overs, and dual-azimuth design for superior positional accuracy. Additionally, CE-6000CH features integrated computerized motion control and programmable logic control (PLC) for unparalleled accuracy, performance, and lastly, reliability. In terms of safety, USHIO CE-6000CH incorporates a series of safety devices, such as the auto-stop function and automatic alarm systems. This is to ensure safe operation and to protect components from any irregularities or errors. In addition, this machine is compatible with a number of different thin-film materials, such as polypropylene, polycarbonate, and aluminum nitride. CE-6000CH can be operated in either an open-air or a clean room environment, though the latter is recommended to ensure the optimal safety and performance of components. It is also possible to configure the unit with variable precision guidance systems, including hybrid and laser-guided linear motors, for improved accuracy and repeatability. Finally, USHIO CE-6000CH comes with several accessories, including wafer support systems, coating tools, and substrate-to-substrate exposure systems. This ensures that the machine is capable of handling a wide range of applications and material types, while offering reliable operation and superior performance.
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