Used USHIO UMA-802-H55RM #9226138 for sale

USHIO UMA-802-H55RM
Manufacturer
USHIO
Model
UMA-802-H55RM
ID: 9226138
Wafer Size: 6"
Vintage: 1989
UV Bake system, 6" 1989 vintage.
USHIO UMA-802-H55RM Exposure Equipment is an integrated exposure solution created for use in dry etching and precision lithography processes. It features a compact design, and is capable of high-performance, high-precision processing. This system is ideal for a variety of exposure applications, including photolithography, powder metalization, and dielectric film formation. The unit has an optimized substrate stage, which delivers high levels of positional accuracy for both the X and Y axes. This allows for precise exposure control and repeatable results. The built-in stage also includes an adjustable tilt angle, which allows the user to make vertical and horizontal corrections to exposure processing. UMA-802-H55RM Exposure Machine also has a 200mm field synchronization feature. This feature performs X and Y movements of the substrate stage with a mirror inversion mechanism. This guarantees that the field size is always the same no matter where the exposure occurs. The tool utilizes an embedded shutter and timer, which allows the user to control the amount of time any sample is exposed. This helps to reduce any variations in exposure, ensuring consistent results every time. Additionally, the shutter can be electronically adjusted by the user, allowing for more precise, repeatable results. USHIO UMA-802-H55RM Exposure Asset has a built-in wafer and mask alert detection model. This equipment ensures that any flaws in the mask alignment and wafer registration are identified, and alerts the user to take corrective action. This can drastically improve the consistency of exposure processing. UMA-802-H55RM Exposure System also features a tilt and site-shift detection unit. This machine works in tandem with the wafer and mask alert detection tool, and allows users to diagnose and correct any misalignments while exposure is still in progress. Finally, the asset is equipped with a high-end vacuum model. This equipment prevents the introduction of particles or contaminants into the environment, and ensures that the system remains free of dust and debris. This vacuum unit also prevents wafer sticking in the chamber, which can cause damage to the machine and time-consuming repair jobs. USHIO UMA-802-H55RM Exposure Tool is a high-precision, integrated exposure solution created for use in dry etching and lithography processes. It is designed to deliver repeatable results, and is equipped with features such as a 200mm field synchronization feature, an adjustable tilt angle, an embedded exposure timer, and a high-end vacuum asset. These features ensure that users can maintain high levels of accuracy and consistency throughout their processing tasks.
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