Used CROWN SOT-23 MLP #9391922 for sale

CROWN SOT-23 MLP
ID: 9391922
Mold die machine.
CROWN SOT-23 MLP is a space-saving, high-performance multilayer package for many electronic and digital devices. This package is based on an advanced, patented technology that integrates multiple layers of components securely and compactly into a single package. It features an accessible inner layer, suitable for mounting various types of active components such as resistors and transistors with extremely small contact pitches. SOT-23 MLP package is easy to install and is highly suitable for a wide range of applications such as robotics, diagnostics, medical equipment, video game controllers, and wearables. It is compatible with most surface mount technology (SMT) lines and gives a strong performance in terms of mechanical strength and thermal performance. The main advantages of CROWN SOT-23 MLP package include its miniaturized design, a reduced package outline, reduced pin length, and improved thermal performance. It also does not require any additional space for mounting components, saving cost and improving production efficiency. Moreover, it has easy-to-access solder pads which makes it easy to access inner layer components. Additionally, this package provides design engineers with flexibility in designing the inner layers due to its high substrate planarization, allowing easy solder wicking and component placement. It also features good electrical properties, allowing for thicker metallization layers for improved quality levels, better noise insulation, improved EMI reduction, and enhanced signal integrity. SOT-23 MLP package offers an extended temperature range, making it suitable for rugged and harsh conditions. Its compelling feature is its capability to support a wide range of operating voltage and current levels, providing reliability of long-running operations in various temperatures and conditions. Furthermore, this package is RoHS compliant, ensuring that its materials or components do not contain any hazardous substances that can have a negative impact on people's health or environment. Therefore, it makes the package free of substances that are harmful to both people and the environment. Overall, CROWN SOT-23 MLP package is an excellent solution for designing advanced and reliable digital/electronic devices in tight spaces, achieving the best performance in the market.
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