Used NEXTEST / TERADYNE Magnum I SSV #293654730 for sale

NEXTEST / TERADYNE Magnum I SSV is a high-end final test equipment used for functional testing, wafer sort testing and analog testing of semiconductor devices. This system features a number of complex features such as an advanced fault library, advanced diagnostics, an embedded scripting language and an automatic probe tuning unit. NEXTEST Magnum I SSV features an open architecture which allows almost any type of test circuitry to be used, as well as distributed architectures that offer an optional modularity as well as a wide range of test configurations. It includes a number of advanced test capabilities such as data acquisition, serial data protocol testing and burn-in testing. In order to accommodate the latest test technologies, the machine also offers hardware and software upgrades that can be applied to add new features and capabilities. TERADYNE Magnum I SSV offers excellent diagnostic capabilities that help identify faults or defects in the design or manufacturing process that may not be detectable by standard metrology tests. It also comes with a variety of frame, tray and fixture hardware options that allow for a wide range of die-sizes and circuit configurations to be tested to high accuracy and repeatability. Finally, the tool is capable of performing multiple modes of test including contact and non-contact, time domain and frequency domain, signal-to-noise characterization and parametric measurements. Magnum I SSV has proven to be a reliable and robust solution for a wide range of test requirements. Its high flexibility and modularity makes it ideal for a variety of uses including field testing, laboratory analysis, production test and product characterization. Additionally, its advanced fault library and scripting capabilities enable it to quickly identify and categorize design, fabrication and assembly faults, saving time and money in the product development cycle. The asset's excellent performance and accuracy, coupled with its cost effectiveness and flexibility, make it a cost-effective and desirable solution for a wide range of semiconductor device testing needs.