Used NEXTEST / TERADYNE Magnum II EV #9262995 for sale

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ID: 9262995
Wafer Size: 12"
Vintage: 2013
Memory tester, 12" Mag II main boards Bottom purge assembly THERMOSTREAM Plate with fittings Nexcard TLA boards: 90522R1 151BGA Nexcard 144LGA Nexcard Nexcard-HDG0401A - 156B USSD HDG0490A Hilo Frequency: 220 MHz No Hard Disk Drive (HDD) 2013 vintage.
NEXTEST / TERADYNE Magnum II EV is a final test solution designed to meet the demands of modern semiconductor manufacturing. It is an all-in-one solution that combines comprehensive test coverage with advanced features and a compact form factor. Its advanced capabilities make it ideal for testing both the latest and legacy devices while providing superior accuracy and precision. NEXTEST Magnum II EV equipment utilizes a fully equipped Automated Test Head (ATH) for maximum performance. The ATH consists of a mainframe, multi-site test head, and controller unit, in addition to support instruments that aid in processing and storing data. This feature allows for multiple units to be connected simultaneously to enable the highest levels of performance. With the integrated test head, setup and operation times are significantly reduced, resulting in improved test throughput. TERADYNE Magnum II EV system also features a die-level FastIR test option that expedites the testing process by quickly and accurately capturing data from chip die. This eliminates the need for multiple boards and ensures quick, efficient test coverage. In addition, the unit also supports advanced options such as Fast Flash, Fast Vector, and FastFT. This machine can be configured with up to eight separate test algorithms, including IEEE1149.1 and IEEE1149.4 DFT. This allows for maximum flexibility when designing and debugging test programs. Magnum II EV is controlled via an intuitive, user-friendly GUI, which makes setup and operation easier than ever. With its highly customizable interface, users can quickly and easily navigate between different test programs, making it simple for users to quickly and efficiently design test programs for various devices. NEXTEST / TERADYNE Magnum II EV tool also features comprehensive testing coverage, with up to eight data points per pin, and a maximum of six tests per die. This ensures thorough testing coverage, providing peace of mind that any problems that exist are properly identified and repaired. The asset is also capable of testing up to four times faster than competitive offerings, allowing for increased production throughput and improved cost savings. Additionally, NEXTEST Magnum II EV model is built with robust reliability measures, including redundant power supplies and ESD safe components, ensuring long-term stability. Overall, TERADYNE Magnum II EV is a complete, all-in-one, final test solution ideal for semiconductor device manufacturers. With its comprehensive testing support, advanced features, and easy-to-use interface, it provides superior accuracy and precision in a compact form factor.
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