Used NEXTEST / TERADYNE Magnum II SSV #9364670 for sale

NEXTEST / TERADYNE Magnum II SSV (Scanning Equipment Verification) final test system is a market leading, high throughput, advanced scan and analog tester. NEXTEST Magnum II SSV is designed to deliver precise and comprehensive failure analysis for semiconductor production testing through its advanced testing features. The unit is capable of handling multiple test cycles simultaneously, as well as significantly decrease test time. It utilizes a parallel pattern scheduling that significantly shortens test time, allowing for an increase in wafer throughput. Additionally, the machine includes multiple high-growth features, such as boundary scan testing, analog test, voltage compression testing, and the ability to perform package test. TERADYNE Magnum II SSV includes a 5200 MHz test engine and an enhanced memory architecture that supports up to 3GB of dedicated memory. It supports up to 4,032 digital channels and 1,536 analog channels, which makes it suitable for a range of challenging testing applications. Its scan and analog tester combine into one tool, which simplifies test program maintenance and further reduces test time. Magnum II SSV also provides built-in automated test program calibration and calibration data management. This allows the calibration cycle to run while the test run is already in progress, which reduces test time significantly. Additionally, the asset is designed to allow up to 16 test systems to be interconnected and controlled by a single host. This makes testing large batches of wafers much faster and more efficient. NEXTEST / TERADYNE Magnum II SSV provides comprehensive failure analysis capabilities, with a wide range of analytical criteria and utilities. It incorporates a real-time digital built-in self-test and in-circuit diagnosis capabilities. The model also includes Temp-Comp analysis, which provides temperature coefficient analysis of critical analog nodes. Finally, NEXTEST Magnum II SSV features a high-density form factor and a robust equipment design that includes multiple redundant configurable clocks and power supplies, and support for an industry standard industrial Ethernet interface. This allows engineers the flexibility to design high-speed, high-density systems while decreasing system risk.