Used NEXTEST / TERADYNE Magnum SSV #9407007 for sale

NEXTEST / TERADYNE Magnum SSV is a comprehensive final test equipment for high-density logic and mixed signal devices. NEXTEST Magnum SSV offers high flexibility and is designed for maximum test coverage of all device types from memory to systems-on-chip (SoC). It is designed for high-speed, high-accuracy testing to meet today's stringent quality and cost requirements. TERADYNE Magnum SSV is based on a modular system architecture, consisting of a stable high-speed DSP mainframe, a powerful test engine, and a scalability feature that enables it to support various module configurations. The mainframe supports up to 16 to 256 independent data channels and up to four instrument slots per channel. The test engine provides high-speed test programs, while the scalability feature allows Magnum SSV to quickly configure instrumentation configurations to match a wide variety of applications. NEXTEST / TERADYNE Magnum SSV is designed for a variety of applications, including analog and digital testing, RF, EMC, and AC and DC power testing. It has a built-in production data and traceability feature that allows users to increase test accuracy, reduce setup times, and quickly analyze key test metrics. The unit also features high-speed, high-knowledge, and pin-accurate testing to help ensure the highest quality. NEXTEST Magnum SSV also offers online reporting and state-of-the-art support for parallel test systems. TERADYNE Magnum SSV is designed for both manual and automated test environments, and has powerful and flexible test scripting language options. The intuitive graphical user interface (GUI) enables easy and quick setup and test management. It also provides a test visualization feature that allows you to quickly assess and debug test programs on the spot. With the help of powerful hardware features such as hardware debugging and trace analysis, Magnum SSV is able to deliver maximum test efficiency. To maximize performance while minimizing test execution times, NEXTEST / TERADYNE Magnum SSV uses next-generation ASICs with high-resolution current and voltage sensing capabilities. The machine has self-healing test algorithms that minimize faults in high-density logic devices. With its high-speed, high-knowledge, and pin-accurate testing, NEXTEST Magnum SSV is able to meet the most stringent quality requirements for device testing. Overall, TERADYNE Magnum SSV provides a comprehensive and high-speed final test tool for high-density logic and mixed-signal devices. Its powerful and flexible architecture allows users to quickly configure instrumentation to match various applications, while its self-healing test algorithms provide maximum test efficiency.