Used NEXTEST / TERADYNE Magnum SSV #9407015 for sale

NEXTEST / TERADYNE Magnum SSV is a high speed and high resolution final test equipment designed to meet the demands of high complexity semiconductor designs. The system is capable of testing a wide range of packages, including fine pitch and ultra-fine pitch packages. It offers automated package handling and accuracy of up to 20 μm with a high throughput rate of up to 200 WPH (Wafer Per Hour). The unit's main features include: high speed and accuracy tester, fast throughput, low cost and high resolution. The machine is equipped with an advanced scanner that is designed for ultra-high speed and accuracy testing, allowing for a high throughput rate of up to 200 WPH. The high speed and accuracy tester can handle up to 8,000 I/O channels and can support a wide range of different connector types. The tool also includes a multi-site calibrator which helps to ensure consistent performance of the asset by reducing the need for off-site calibration. The model is built with a high-density package which offers a low cost and high resolution solution. It utilizes the latest programmable logic controller (PLC) technologies and advanced data processing methods. This ensures that the speed and accuracy of the equipment meet the demands of high complexity designs. The system is designed for easy integration into production processes and provides a wide range of services, including DFT (Design for Test), test pattern generation, wafer sort programming and device verification. Furthermore, it provides a wide range of online and offline service solutions, such as failure analysis and process optimization. The unit also offers robust test quality and high performance. The machine uses advanced test cell management capabilities and process monitoring. This ensures that the tool is stable and reliable during the testing process. Overall, NEXTEST Magnum SSV is a reliable, high speed and high resolution final test asset, which satisfies modern semiconductor device test requirements. It is an ideal solution for high complexity designs, offering a combination of speed, accuracy, flexibility, and cost effectiveness.