Used NEXTEST / TERADYNE Magnum SSV #9407020 for sale

NEXTEST / TERADYNE Magnum SSV is an advanced universal, production-level automatic test equipment. It is designed for complex Printed Circuit Board (PCB) assemblies and modules testing and verification. It combines full parallel test execution with a simultaneous system optimization feature for maximizing test coverage, accuracy and throughput. The unit consists of a computer-based control machine, power distribution units, a variety of test handlers, an extensive selection of test pins and probes, and fault isolation capabilities. Its extensive functionality includes: DFT compliance checks, board probing and testing, targeted In-Circuit Test (ICT), Boundary Scan (BS) testing, functional and parametric testing, isolation testing and thermal imaging. Its main components include: * Controller: This is a computer-based control tool which provides effective software architecture and integrates the various test components and operations providing control, measurement and data analysis functions. It supports real-time data acquisition and performance monitoring. * Power Distribution Units (PDUs): These devices provide the capabilities to monitor, detect and control circuit board electrical power and performance while maintaining board simulations. * Test Handlers: NEXTEST Magnum SSV has a variety of test handlers to enable high daisy chain testing performance such as NEXTEST J750 digital pinmap handler, the FLEX-2/FLEX-4 for manual spring tests and flying probe solutions. I Test Pins/Probes: These are the probes and pins which are used to make the electrical contact between the boards to be tested and the test asset. Fault Isolation: TERADYNE Magnum SSV has the capability to provide diagnosis of PCB and component problems through interactive diagnostics tools, automated fault location analysis and failure interpretation analysis. Magnum SSV Test Model is a reliable, time-saving and cost-effective solution for any high-volume production test and verification requirements. Its features are designed to maximize test coverage, accuracy and throughput in a wide range of applications such as automotive, aerospace and computer/peripherals.