Used TERADYNE 239-026-xx #9189896 for sale

TERADYNE 239-026-xx Final Test Equipment is specifically designed for the characterization, screening, and final testing of semiconductor devices in wafer-level or packaged form. This modular system offers a reliable, high-performance platform for characterization and final test applications and enables a flexible array of test capabilities for a wide variety of high-throughput device requirements.239-026-xx offers true parallel testing, high-speed instrument control, high-speed data capture, test board instrumentation and multi-functional test capabilities. The main unit components include a programmable test control and mainframe, a high-speed TAP controller, multiple mainframe slots for test head and control cards, and various multiple-site test interface cards. The machine allows for simultaneous operation of multiple test cards, which is useful for testing multiple device sites in parallel to speed up throughput and reduce test time. Additionally, multiple test boards can be deployed in a modular configuration, allowing for flexible test conditioning at a low cost. The tool supports a variety of communication protocols, including IEEE 488 (GPIB) and SCPI. This helps ensure compatibility with various top-level instrumentation controllers such as TERADYNE E5700 series. TERADYNE 239-026-xx is further enhanced with a wide variety of user-friendly instrumentation features, such as an automated test program, graphical programming, multiple test langues, limit checking, direct instrument/memory access, serial test setup, capture rate tweaking and high-speed data capture. Through efficient test board instrumentation, users can economically test multiple devices simultaneously, using both analog and digital I/O types, as well as a variety of analog and digital parametric tests, such as DMM, DC, AC and signal tests. 239-026-xx asset also offers several model options for enhanced testing capabilities. For example, the equipment can be configured with multiple differential channel interface cards, allowing for more simultaneous tests with multiple devices. Additionally, Multi-function Test Options (MFTO) provides cost-effective testing solutions that reduce test and cost in a variety of semiconductor test applications. This system can also be coupled with the optional interfacing options such as a High-density Digital Serial I/O, Digital logic Test, Analog Test, AC/DC Test, Temperature Test, and many more. TERADYNE 239-026-xx Final Test Unit is a reliable high-performance platform for characterization and final test applications, offering a wide range of capabilities for a variety of device test requirements. With advanced instrumentation features, flexible multiple-site test capabilities, and a variety of interface and machine options, 239-026-xx can be configured to provide a cost-effective solution for maximizing throughput and reducing test time.