Used TERADYNE 974-331-44 #9412040 for sale

TERADYNE 974-331-44 Final Test Equipment is an advanced, high-speed integrated circuit test platform. It offers test solutions for wafer probing, production test, multi-site, and board test applications. 974-331-44 includes an advanced on-board TERADYNE J750 Prober System for wafer probing and OEM specific modules for wafer level test. The unit is designed for high test coverage and high speed testing of multiple devices simultaneously. It can accommodate two to eight devices per site, with a maximum test speed of up to 950K tests/second. It has two main frames, a base chassis and two 2-piece body frames, each featuring up to 6 1.5 inch height drive cards. It also features a mini-bond bus for data and control, and a high-performance Test Assembly Processor as an embedded controller. TERADYNE 974-331-44 machine operates with a wide range of user-configurable, high-throughput, low-cost test programs. The user-friendly GUI provides real-time visual feedback and data capture. The tool supports all the major electrical sub systems such as, volts, current and frequency. It also supports a variety of specialty subsystems, like high-voltage, laser testers, waveform, AC/DC pulse and ultra-low-level logic testers. The asset also offers diagnostic and repair capabilities with a fault-tolerant design. It runs on realistic test times, automatically synchronizing with the sweep data of the assembly tester. It also works with Multi-Site Auto parameters, and allows users to customize the test set-up and run the board test program. Its features include integrated traceability, automatic fault data logging, ESD management and reporting, and closed-loop error handling. The model also provides high-resolution thermal imaging for thermal cycling, temperature characterization and other temperature-intensive tests. It is compliant with AEC/JEDEC standards and operates with a wide range of test temperature ranges, from -40 Celsius to +125 Celsius. Overall, 974-331-44 Final Test Equipment offers a great level of flexibility and performance in testing multiple devices simultaneously, making it an ideal choice for a variety of test applications.