Used TERADYNE Catalyst #9213109 for sale

Manufacturer
TERADYNE
Model
Catalyst
ID: 9213109
Tester.
TERADYNE Catalyst is a leading-edge final test platform that automates the testing of IC packages and components. It includes specifications for high-resolution imaging, defect inspection and analysis, as well as high-speed package testing, implementation of test plans, alignment station and test head indexing, interface control and data acquisition. The equipment offers advanced features such as fast test time, high resolution imaging and defect inspection, precise die-level test plans and diagnostic systems, and ability to test a variety of packages and components. Catalyst also offers a user-friendly tool to create and manage test plans, analyze data, and generate yield reports. TERADYNE Catalyst can perform high-speed, high-accuracy final testing of IC packages and components. The system uses an advanced alignment station to quickly acquire die placement and precise X/Y coordinates for test stations. Test heads are indexed with an automated vision unit that aligns the package and identifies test nodes in each individual die. This ensures accuracy and repeatability across multiple tests. Test plans are customized for each package type and node and include parameters for pass/fail criteria, power-on sequences, test insertion events, and data acquisition and analysis. Catalyst provides detailed data acquisition with automated evaluation and real-time report generation. The machine also provides post-test analysis by displaying defect analysis images and identifying failure causes. For each test plan, test nodes can be positioned on contactors with variable force applications according to package type. TERADYNE Catalyst automates test interface communication, controls current waveforms, voltage waveforms, and timing waveforms according to test parameters. The tool evaluates real-time results, produces yield data, and generates detailed test reports for each package. Catalyst is a reliable and cost-effective solution for achieving high-resolution IC package and component testing in production environments. It delivers a comprehensive range of testing capabilities, ensuring product quality and ensuring robust performance throughout the entire IC supply chain.
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