Used TERADYNE iFlex #9145488 for sale

Manufacturer
TERADYNE
Model
iFlex
ID: 9145488
Tester Work station: Model: HP xw8400 System O/S: Windows XP SP2 2002 IGXL Version: V5.10.30_flx CPU: Xeon® CPU CPU CLK: 2.33GHz Main memory: 2GB LVM Size: 64 M CLK Speed: 200MHZ TH: HSD: (48) Digital channels Linear vector memory (LVM): 64 MB Fail map memory (FMM) Subroutine vector memory (SVM): 1 kB DC30: V/I Channels: 20 Current range: 200 mA DC75: V/I Channels: 4 (multiplexed) Current range: 0 mA to 2A BBAC: (2) Source channels (2) Digitizer channels Frequency range: DC to 15 MHz VHFAC: (2) Digitized waveform capture Time measurement unit (TMU) Support board: Reference clock DC Calibration TH: HSD: Slot Quantity Ch 2 4EA 192 3 4 5 DC75: 8 1EA VHFAC: 13 2EA 26 Support board: 7 2EA 20.
TERADYNE iFlex is a versatile and scalable final test equipment with a modular architecture that can address current and future test needs. Built with flexibility and easy scalability in mind, its next-generation memtest technology allows it to quickly and accurately test a wide variety of advanced integrated circuits. Its modular architecture enables the entire test process to be customized and configured to meet varying test protocols, and it can be integrated into an existing automated test system for efficient production process flow. TERADYNE I-FLEX features a comprehensive wafer level testing solution that enables efficient testing of the most challenging heterogeneous devices in a single test. Its patented memtest architecture and faster scan time, lower power consumption, and enhanced signal capture allow it to accurately detect even the smallest faults. The test unit can also be configured with an on-board high-speed vision inspection machine for automated wafer inspection. The tool offers a suite of powerful features designed to facilitate the high-volume production test environment, including a built-in multilingual interface, environmental monitoring, JTAG programming, device programmability, and flexible test scheduling. Its integrated control and analysis software provide full device-level test control and analysis capabilities, enabling the asset to be used for both process and quality control. The model eliminates the need for manual maintenance, as the robots are designed for quick and easy reconfiguration. The smart tooling technology also allows the equipment to adapt to different device and package types, enabling fast reconfigurations without manual intervention. IFlex was designed to enable customers to quickly create high-volume production processes that accommodate frequent and ongoing changes in device and package types. The system is ideally suited for testing a variety of products, including integrated circuits, BGA, flip-chip, and chip-on-board. It can also be used for wafer level testing of complex systems-on-chips. The unit is perfect for the testing needs of advanced and next-generation products.
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