Used TERADYNE J971 #9239842 for sale

TERADYNE J971 Final Test Equipment is an integrated solution designed for high-performance mass production test applications. The system features on-board probing capabilities for testing IC packages such as BGA and Surface Mount Technology (SMT). It also offers integrated solutions for measuring electro-mechanical dynamics, signal integrity, environment and timing tests. The unit has powerfulsoftware features including board setup and test libraries, graphical programming environment, power monitoring, anomaly and non-conforming parts analysis, pre-programmed test conditions, and data acquisition. TERADYNE J 971 Final Test Machine employs a universal socket platform with standard testing capabilities to quickly program and execute test programs. The tool can be configured to include over fifty harness for testing diverse electro-mechanical applications. The on-board probing capability eliminates the need for wiring harnesses and simplifies programming. High-speed serial links can be added for board layout analysis, test pattern generation and result analysis. The asset control board comprises a 32-bit RISC microcontroller, Network Interface Board and Hard Disk Drive to store test program and test results data. It also has and adapter board for supporting IEEE-1149.1 (JTAG) or IEEE-1149.4 (IJ-SIT) interfaces for device boundary scan tests. An integrated Compact PCI-based IEEE-1394b (FireWire) controller is also included to support in-board and off-board boundary scan tests. J-971 Final Test Model includes a complete suite of software - allowing users to create, modify and execute test plans. The software can also be used to visually monitor operations, track and review test results, monitor power supply performance and modify test parameters. It also features equipment health monitoring, anomaly reports, and sub-system event logging. TERADYNE J-971 Final Test Unit is robust and reliable, enabling customers to ensure quality control and minimize downtime. The machine is designed to meet the demands of high-volume manufacturing test applications. It is capable of testing many types of IC packages and has extendable capabilities for various types of testing. The tool can easily integrate with production and process control systems to ensure that the products manufactured are of the highest quality.