Used TERADYNE UltraFlex #9199300 for sale

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Manufacturer
TERADYNE
Model
UltraFlex
ID: 9199300
Vintage: 2006
Testers (26) Slots (4) HSD100 64 Pins (4) DCIO 196 Pins (4) HexVS Max 15 V, 15A per boards (3) VSM Max 4 V, 81A per boards With DELTA DESIGN Summit ATC handler Slot Type Idprom (Type) 0 HexVS 974-294-00 HexVS 956-388-00 HexVS Analog board 956-387-00 HexVS Power board 939-266-02 1 HexVS 974-294-00 HexVS 956-388-00 HexVS Analog board 956-387-00 HexVS Power board 939-266-02 2 HSD-M 974-331-22 HSD-M 956-417-22 Power board 956-360-02 PSP 956-308-00 3 HSD-M 974-331-22 HSD-M 956-417-22 Power board 956-360-02 PSP 956-308-00 4 HSD-M 974-331-44 HSD-M 956-417-44 Power board 956-360-02 PSP 956-308-00 5 HSD-M 974-331-44 HSD-M 956-417-44 Power board 956-360-02 PSP 956-308-00 10 HexVS 974-294-00 HexVS 956-388-00 HexVS Analog board 956-387-00 HexVS Power board 939-266-02 11 HexVS 974-294-00 HexVS 956-388-00 HexVS Analog board 956-387-00 HexVS Power board 939-266-02 14 DCIO Board 974-390-02 DCIO Board 956-448-02 Power board 956-426-51 PSP 956-308-00 15 DCIO Board 974-390-02 DCIO Board 956-448-02 Power board 956-426-51 PSP 956-308-00 16 DCIO Board 974-390-02 DCIO Board 956-448-02 Power board 956-426-51 PSP 956-308-00 17 DCIO Board 974-390-02 DCIO Board 956-448-02 Power board 956-426-51 PSP 956-308-00 18 VSM 974-296-01 VSM 956-395-01 Power board 956-394-02 Digital board 956-396-01 19 VSM 974-296-01 VSM 956-395-01 Power board 956-394-02 Digital board 956-396-01 20 VSM 974-296-01 VSM 956-395-01 Power board 956-394-00 Digital board 956-396-00 24 Support board 974-221-02 Support board 956-416-00 Power board 956-359-10 TCM 956-419-01 DCCM 949-938-02 25 Support board 974-221-11 Support board 956-416-11 Powerboard 956-359-21 62 Distribution board 956-455-00 Distribution board 956-455-00 63 Distribution board 956-455-00 Distribution board 956-455-00 2006 vintage.
TERADYNE UltraFlex Final Test Equipment is a state-of-the-art, flexible, reliable, and cost-effective solution for semiconductor device testing and Burn-in systems. It consists of an integrated, scalable open platform with advanced EasyTest and Insight technologies that provide ultra-high performance, accuracy, and low cost of test. The system provides a wide range of configurations and options to best meet customers' needs. It offers the flexibility to quickly adapt to different semiconductor device types, process technologies, and test requirements. Its user-friendly interface makes it easy to program, configure, and maintain the unit. TERADYNE ULTRA FLEX machine is designed to maximize test coverage, efficiency, and throughput while reducing test costs, reducing time-to-market and delivering high reliability. The tool has several benefits, including high throughput, revolutionary EasyTest software, and an advanced, scalable open platform. UltraFlex platform is designed with the latest technology, allowing test asset customization and upgrade. The model offers integrated test solutions for RF, mixed-signal, Analog/Digital mixed-mode, and digital components. The equipment includes multiple test resources for a variety of device architectures, power management details and supporting multi-language support for several industry standard software applications. The system also includes Thermal Management such as airflow management, temperature gradients, and thermal optimization for device types like DUTs and WDs. In addition, it integrates special test unit features like Multi-Slot Extender Board, Flexible Handling and Robotic Loader, and Touch Screen Graphical User Interface. Other features include Advanced FPGA-Based Signal Analysis and Multi-Processor-Based Automation. ULTRA FLEX Final Test Machine is designed to increase production yields, minimize test costs and reduce time-to-market. Furthermore, the tool is designed to ensure the highest manufacturing safety and reliability standards. It integrates with TERADYNE Insight™ technology, providing powerful yield analysis, real-time data analysis, and longer term device trending. The asset also supports data analytics, trend analysis and device/lot tracking enabling customers to gain maximum insight into the condition of their test site. Overall, TERADYNE UltraFlex Final Test Model is an innovative and advanced solution for semiconductor device testing and burn-in systems that is both cost-effective and reliable for the entire device test process. Its easy-to-use features and automated capabilities are ideal for testing power electronics, mixed-signal and digitally programmable devices for increased efficiency and accuracy. This equipment is perfect for device manufacturers and test labs looking for an advanced, reliable and cost-effective system to meet their test requirements.
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