Used TERADYNE UltraFlex #9232724 for sale

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Manufacturer
TERADYNE
Model
UltraFlex
ID: 9232724
Vintage: 2010
Tester (2) DC-30, 974-217-30 (2) Distribution boards, 956-455-00 2nd Gen DSP Computer (2) HexVS, 974-294-20 (8) HSD-M, 974-331-44 (2) PTS 310 Synthesizers, 361-560-00 Support board (Master), 974-221-03 Support board (Slave), 974-221-11 GPIO Turbo frame (Dual) Turbo base HDVS MW Measure board MW SYNTHLO MW SYNTHREF HSS-6400 (SB6G) DSP 2009 XW8400 Workstation Configuration: P/N / Description 810-724-00 / SC-R semiconductor test system 979-389-00 / Option expansion cabinet 810-851-00 / Kit, UF exp cab PWR IN-401-24 / Up to 24 testhead slots (8) 979-331-22 / HSD1000 instrument assembly (8) IN-144-40 / 400 MBPS speed (8) IN-325-60 / 256m pattern depth IN-124-88 / HSD1000 dssc license system wide (2) 979-217-30 / Assy, DC30 (2) 979-294-00 / HEXVS instrument assembly 979-808-00 / Turbo AC single SRC / CAP channel assy IN-171-41 / Full single channel turbo lic 979-811-00 / Kit, UF turbo AC PTS base kit 979-223-00 / Dual processor DSP kit (10) 979-359-00 / Filler board assembly 814-602-01 / Kit, XW8400 20ft CBL IN-000-90 / Microsoft office 2003 right-to-use license 979-427-00 / Kit 19" LCD monitor option 979-370 00 / Kit-computer cart 24'' 814-618-01 / 2GB Ram extension for XW8400 IN-400-00 / IG-XL system license IN-401-00 / IG-XL-TSTR SVC dacmcn-kla int 810-724-05 / sc-r semiconductor test system 979-389-00 / Option expansion cabinet 810-851-00 / Exp cabinet power kit IN-401-24 / Up to 24 enabled TH slots 979-126-20 / Assy heat exchanger 24 slots 9979-377-00 / Kit card package STD + 1EXP (8) 979-331-22 / HSD 1000 Mech assy (8) IN-141-12 / HSD Board 1000 Mbps data rte license (6.3-7.49) (8) IN-325-66 / HSD Board 256M Pattern depth license (6.3-7.49) IN-124-88 / HSD 100 DSSC license system wide (2) 979-217-30 / DC30 Ports (48) IN-403-00 / HDVS Channel license 979-496-00 / High density vs assy 979-294-00 / Assy JAGUAR H15AVS Port IN-320-64 / HSS Speed board (5860) S86400 (3.6-7.49) 979-336-02 / Assy tornado HLA IN-175-25 / SB 6G 256M Pattern depth license IN-174-00 / SB 6G Signature compare IN-174-01 / SB 6G Jitter insertion license IN-174-02 / SB 6G Jitter measure license 979-905-00 / Turbo AC dual SRC / CAP Channel IN-171-42 / Dual channel turbo license 979-811-00 / Base kit 1 cable bundle up to 4 turbo AC 810-941-00 / GIGADIG HD 814-550-00 / Ultrawave 12G Splitter assembly (SC) IN-250-02 / Ultrawave 12G (16) Universal RF Ports 814-641-00 / Ultrawave 12G MW Meas board 814-641-10 / Ultrawave 12G MW Meas cable 814-643-00 / Ultrawave 12G MW Synthesizer LO 814-643-10 / Ultrawave 12G MW Synth LO cable (2) IN-251-04 / Ultrawave 12G ON Board dual AWG IN-251-03 / Ultrawave 12G 2nd Receiver license 814-644-00 / Ultrawave 12G MW Synthesizer DR 814-644-10 / Ultrawave 12G MW Synthor cable 602-664-00 / Kit cable 10 MHZ GPO 410 979-223-40 / DSP Kit dual quad processor 979-516-00 / GPIO for 24 slots (4) 979-359-00 / Kit filler board 814-602-01 / XW8400 System computer IN-000-90 / Microsoft office 2003 right to use license 979-427-00 / Kit 19" LCD Monitor option 979-428-00 / Kit second 19" LCD Monitor 979-369-00 / Kit computer cart dual monitor 514-518-01 / 2GB Ram extension for XW8400 IN-401-00 / IG-Xl TSTR SVC CAEmon KLA INT IN-749-00 / IG-Xl System license (7.07-49) IN-115-00 / IST Year aul IG XL system license 979-455-41 / Ram 24 slot RH Enhanced manipulator 979-528-04 / Integration kit SC ram manip right 979-260-00 / Assy nitrogen purge unit jag 979-230-00 / Testhead docking if IPD and CPD, UF24 901-089-00 / WI 24 POS IEEE 488, 4 meter long 979-466-00 / (24) Slot control tool dib stifferner base kits (2)979-467-06 / DC30 Dib strip kit 810-998-00 / Ultrawave MW Meas continuity module 810-998-01 / Ultrawave MW Synth LO continuity strip 810-998-02 / Ultrawave MW Synth DR DIB Strip 979-467-22 / GPIO Dib strip kit 979-467-13 / HDVS General purpose DIB Strip (2) 979-467-03 / HEXVS Dib strip kit (9) 979-467-02 / HSD S86G / GIGADIG 979-467-14 / DIB Strip for S86G 2010 vintage.
TERADYNE UltraFlex is a powerful final test equipment designed to quickly and reliably diagnose electronic components. It is especially well-suited for testing components in high-density applications, such as multi-layered printed circuit boards. Its main features include a scalable modular design, high speed test channels, and advanced algorithms for automated test program generation and optimization. This makes it a perfect choice for testing even the most complex electronic components. The scalable modular design on TERADYNE ULTRA FLEX allows it to be quickly configured to meet the needs of specific applications. It can accept up to 24 test channels in a single configuration, and its universal test interface supports all common test needs. This makes it a very versatile system, capable of precisely testing all kinds of components. In terms of speed, UltraFlex is exceptionally fast. It uses both parallel and sequential test technology to ensure maximum testing speed, while still minimizing potential errors. In addition, the unit has a test-centric programming environment, which allows data to be transferred more quickly and efficiently between the test hardware and the control machine. This ensures maximum testing throughput and accuracy. Finally, ULTRA FLEX utilizes advanced algorithms for automated test program generation and optimization. This allows the tool to automatically generate efficient test programs for each individual application. It can also adjust specific parameters, such as test times and voltage levels, as needed. This ensures that the asset is able to generate the most efficient and accurate test programs possible. In conclusion, TERADYNE UltraFlex is an excellent final test model for testing electronic components in high-density applications. Its modular design, high speed test channels, and advanced algorithms for automated test program generation and optimization make it an ideal choice for high-precision, high-quality test applications.
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