Used ADVANTEST M 6300 #293831097 for sale

ADVANTEST M 6300 Handler is a high performance handler that is designed for high-throughput, low-cost handling of small devices. It is suitable for a variety of applications such as wafer dicing, packaging, and wafer bonding. ADVANTEST M6300 offers many features and benefits including high speed, large capacity, flexibility, high versatility, and low capital investment. This handler is designed with a dual-stage linear conveying equipment which allows it to relocate Wafers, chips, or dies at higher speed and with greater accuracy than single-stage conveying systems. The dual-stage system also allows high levels of flexibility and versatility, as it can be configured to meet the specific needs of any application. M 6300 features two laser equipped robots which enable die pick-up, placement, transport, and inspection of the devices being handled. The robots are controlled by a PC based controller which provides an intuitive user interface for easy and efficient programming of robotic motion. The robots are equipped with vision cameras for die inspection, as well as a mechanical device for die positioning. The unit also includes a laser sensor for accurate measuring of distances and angles. M6300 also provides a high accuracy mechanism for die sorting, which uses beam break sensors to identify the position and orientation of the parts being handled. This allows the user to automatically locate, pick, place, and sort parts. Additionally, the machine can be configured to automatically transfer parts between two or more handlers. ADVANTEST M 6300 handler is designed with an integrated vacuum tool, which is used to position, secure, and pick up parts quickly and accurately. The handler is compatible with various pneumatic tools and can be used with a wide range of substrate types, including hardbodies, frames, and metal carriers. Overall, ADVANTEST M6300 handler is an ideal solution for high-speed, low-cost handling of small components and devices. It offers the user flexibility, versatility, and high efficiency, with a low capital investment. Its unique features and benefits make it an excellent choice for wafer dicing, packaging, and wafer bonding applications.