Used ADVANTEST M 6541AD #9265096 for sale

ADVANTEST M 6541AD (Automatic Die Bonder) is a handler optimized for 50 um bond pads specifically for die bonding and flip chip applications. It is a high-precision die bonder that offers a variety of die bonding product handling solutions. ADVANTEST M6541AD is a fully automated die bonder with automatic vision inspection and data logging capabilities. The equipment is equipped with a 200mm XYZ motion platform and a die bond head that aligns and bonds die in low, medium or high temperatures. M6541 AD also features tight process control and high throughput production. M 6541 AD is an efficient system with a patented design, and is ideal for multi-die production lines. The unique dual-axis alignment unit enables accurate die placement with fast response times. The vision inspection machine ensures consistent die posture, placement and bond quality. The high precision control logic and high-frequency laser welding capabilities deliver high quality bonds quickly and accurately. Additionally, the tool enables process optimization and real-time data logging for higher yields. ADVANTEST M 6541 AD is a reliable and flexible asset that offers highly precise die placement, die alignment, and glue application. The adhesive dispensing model is an advanced version of the popular hot drop glue equipment. It features a specially designed 360 degree nozzle to provide accurate and repeatable automated glue dispensing. It also supports manual, semi-automatic or fully automatic glue dispenser options as well as manual, semi-automatic, and fully-automated vision cycology for guidance. Overall, ADVANTEST M6541 AD (Automatic Die Bonder) is a reliable and efficient system with high precision die handling capabilities designed to meet the needs of today's semiconductor packaging industry. It offers fast and accurate die placement, alignment, and rapid bonding capabilities as well as customizable process controls and real-time data logging for maximum yields.