Used MULTITEST MT 9308 #293794231 for sale

MULTITEST MT 9308 is an advanced handler equipment used for the bonding and testing of an array of heterogeneous 2D devices used in microelectronics, radio frequency, and communications industries. The handler functions by using a platform that measures parts up to 20 mm with a bonded area of 110 mm by 150mm. This can accommodate up to three different kinds of devices, in multiple sizes and pitches. The handler is designed to enable high throughput to the testing of components due to its one-touch setup and constant system parameters. With its advanced software capabilities, the handler is able to profile, control, and inspect the entire device under test. A variety of safety features have been incorporated into the handler including a hard stop, monitoring of drive seat, auto-mode registration, and dynamic parts recognition. MULTITEST MT9308 also includes a fast response, non-contact optical alignment that is capable of measuring 2D devices. This feature allows for greater accuracy when handling and testing the components. In terms of hardware, MT 9308 employs the use of a low inertia U-arm design, which means the handler is capable of quickly moving the product from in-line to the off-line positions. This provides fast cycle times and increases unit reliability. The handler is designed with a temperature-controlled thermal chuck, which allows for more precise handling of the materials. It also utilizes a parallel linear-axis design for the pressure assembly with a closed loop machine for hassle free operations. Additionally, the handler includes an expandable laser alignment tool. In terms of connectivity, the handler is capable of supporting multiple communication protocols such as an Ethernet, RS232, and USB. Additionally, the handler is equipped with a high-resolution color touch screen panel, which enables the operator to take complete control over their test process. MT9308 is a versatile advanced handler asset that can accommodate multiple device sizes and use its fast response and communication capabilities to provide a higher level of device testing. Its low inertia U-arm design allows for it to quickly move parts on and off the platform, which increases model reliability. Additionally, the presence of a temperature-controlled thermal chuck and a closed loop open for control allows for precise handling and testing of components.