Used NUTEK MFC0100UL #9296720 for sale
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NUTEK MFC0100UL is a wirebondable membrane frame handler. It is an innovative high-performance dispensing handler designed to provide fast, accurate and consistent bonding of a wide variety of different types of wirebonds. It is capable of dispensing very small components, including small conductive traces, through the use of its high-speed micro-dispensing technology. MFC0100UL features a modular system for high precision positioning of wirebondable frames, enabling the handler to accurately locate and bond components with very small pitch and trace patterns. It also includes an integrated optical microscope which comes with adjustable LED lighting for inspecting the components during the bonding process. Additionally, it features two integrated vision systems, one for direct wirebond viewing and a second for automatic pad recognition. This combination provides a reliable, repeatable and safe method of wire bonding. NUTEK MFC0100UL features a three-axis servo-motorized machine design for precise navigation, speed, and accuracy during the wirebonding process. This ensures that all wires are correctly placed with minimal overrun and no misalignment. The handler also features two dispense needles, enabling simultaneous dispensing of small components. With the integrated vision system, it can accurately recognize pads on the component and position the correctly matched needles for the bond operations. MFC0100UL's software is also feature rich including features for bond recipes, pre-load, test parameters and statistical process control. Itcomes with a library of standard bond recipes, enabling users to customize their settings to meet their specific production needs. It also includes several diagnostic modes for troubleshooting and maintenance. NUTEK MFC0100UL is a reliable and highly advanced wirebonding handler that ensures consistent repeatability and high-speed performance of a wide variety of components. It is an ideal solution for high-volume manufacturing environments in industries such as consumer electronics, automotive, aeronautics, and other emerging markets that require the most accurate and reliable wirebonding processes.
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