Used RASCO SO 1000T #293763235 for sale

RASCO SO 1000T is a standoff handler designed for use in semiconductor fabrication operations. It is an advanced, low-cost and highly efficient handler for thin film devices, IC packages and wafer components. The handler is constructed from a heavy-duty aluminum frame, providing a lightweight and durable base for a variety of handling tasks. Key features include a linear drive for fast pick and place operations, a rotary drive for accurate back-angle scanning and acquisition of data, and a motor drive for moving components within the handler. RASCO SO1000T has a compact footprint, taking up minimal space in semiconductor fabrication facilities. The rotary drive and motor drives provide the capability to move components in both directions while simultaneously assuring accuracy of acquisition. The linear drive offers high-speed rotation of approximately 150 mm per second. Unique to SO-1000T is its ability to acquire data using optical sensors. These sensors are placed on the base of the handler and are used to acquire either up or down orientation of components during operations. This feature is particularly useful for operations in which components must be placed with a specific orientation for correct assembly or placement. RASCO SO-1000T offers a variety of advanced features to enhance its handling capabilities. It has a flexible nozzle design that allows multiple components to be handled by a single nozzle, and a flexible load arm that can be adjusted to accommodate most device sizes. There is also a vision option, which is used to acquire information related to component orientation and height. The handler is equipped with a control system, including several input / output options and a graphical user interface (GUI). The handler is designed for integration into a central automated machine, or for use as a standalone system. It is also suitable for use in a manual operational environment. In summary, RASCO SO-1000 T is an advanced, low-cost and highly efficacious handler for thin film devices, IC packages and wafer components. It offers high-speed operation, optical acquisition of data, flexible nozzles and a control system for users to customize operation. Its compact footprint and durability make it an ideal solution for most semiconductor fabrication operations.