Used SEIKO / EPSON XS-5000F4 #293662916 for sale

SEIKO / EPSON XS-5000F4 Handler is a sophisticated, high-speed, thermosonic bonding machine. It enables the simultaneous and highly efficient bonding of QFPs, BGA, chip-led, connectors, and other components under a wide variety of conditions. This machine is versatile enough to handle high volumes in a variety of package/component configurations. SEIKO XS-5000F4 features a new advanced heating system, which utilizes a high-speed, low-impedance, and highly-precise thermosonic bonding method. This promotes lower profile, more powerful assembly operations. In addition, this machine features an integrated control panel with a graphical user interface, allowing the operator to easily adjust a wide range of parameters. Furthermore, this handler has multiple options available for data analysis and fault detection. EPSON XS-5000F4 is equipped with an advanced dual-probe station, allowing for single-shot placement measurements and cycle time reduction. Furthermore, this machine features high-pressure, low-pressure, and multi-point air cylinders with integrated sensors for controlling grip on the components. In addition, this handler has a built in receptacle for electrical connectors and a vacuum nozzle for cleaning the bonding plates. XS-5000F4 has a number of safety features, ensuring a safe working environment, including proximity sensors, safety fencing, safety screens, power failure protection, over-temperature protection, and alarm notifications for operators. Lastly, SEIKO / EPSON XS-5000F4 is highly reliable and provides consistent, high quality results as evidenced by its integrated microprocessor-based monitoring system. Overall, SEIKO XS-5000F4 Handler is a highly efficient, accurate, and safe machine for a variety of thermal bonding applications. With its advanced heating system, multiple parameters, and safety features, this is an excellent choice for high production rates and consistent results.