Used VARIAN / AMAT / APPLIED MATERIALS VIISion 200 #293595886 for sale
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VARIAN / AMAT / APPLIED MATERIALS VIISion 200 is a high-tech, state-of-the-art ion implanter and monitor. It is a full wafer and single-die ion implanter and monitor specifically designed for research and development applications in the semiconductor industry. AMAT VIISion 200 also has capabilities to transport, align, and process a variety of different materials, making it suitable for many different in-field implantation and monitoring applications. The system consists of a high-energy, high-end ion beam source and an access panel for the use of the various components and processes associated with the implanting and monitoring process. Its strong power source, advanced beam tuning and low noise systems permit the precise control of beam parameters. The transmitter includes an automated wafer loader and advanced motion and robotic systems to facilitate wafer alignment and exact placement. VARIAN VIISion 200 also offers an advanced ion beam monitoring system, which is interfaced with the transmitter and provides a constant view of the process with real-time data. APPLIED MATERIALS VIISion 200 also offers several innovative features and controls, such as temperature control, temperature stabilization, vacuum control, safety monitoring, and advanced software for beam quality and implantation control. In addition, the ion implanter monitor can be used to monitor the wafer quality before, during, and after the process for reliable and repeatable implant results. The advanced capabilities of VIISion 200 make it a key tool in research and development for the semiconductor industry. It offers the most sophisticated technology and features available in an ion implanter, suitable for even the most demanding applications. With its automated movements and advanced temperature, safety and beam control, VARIAN / AMAT / APPLIED MATERIALS VIISion 200 is an essential tool for semiconductor production, enabling the precise and consistent control of the process.
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