Used FEI / MICRION Vectra 986FC #293718111 for sale
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ID: 293718111
Wafer Size: 8"
Focused Ion Beam (FIB) system, 8"
Upgraded to IET / WDR System
Circuit editor: 28 nm
Ion mill column
Acceleration: 50 keV
Ion column resolution: 5 nm
Bipolar power supply
Laser interferometer stage, 8"
Proprietary charge neutralization system
(14) User defined apertures
Pre-soak chamber
(2) Gas Assisted Etching (GAE) stations
Wafer holder, 8"
Current monitor sample holder
Tungsten metal deposition
Hard Disk Drive (HDD), 500 G
RAM Memory, 3400 Megabyte
Gases:
Chlorine / Bromine
Xenon difluoride
Siloxane (TMCTS)
Oxygen
Tungsten
Display:
Colour monitor, 21"
Line resolution (1280 x 1024)
Virtual apertures: (14) Beam currents
Gas delivery system:
Metal (Cl2)
Dielectric (XeF2)
(2) GAE Stations
Penta / Tri nozzle configuration
Dielectric deposition:
Tetra Methyl Cyclote Trasil Oxane (TMCTS)
Oxygen
No IR cameras.
FEI / MICRION Vectra 986FC is a sophisticated ion milling equipment designed for precision material removal and surface modification in the fields of semiconductor manufacturing, materials science, and nanotechnology. This advanced tool enables researchers and engineers to achieve sub-micron accuracy in milling and polishing tasks, making it an essential instrument for fabricating complex structures with high precision. At the heart of FEI Vectra 986FC system is an ion beam source that generates high-energy ions, typically made of argon or gallium, to bombard the surface of the sample. These ions sputter away material from the surface, selectively removing layers to create precise patterns and structures. The ion beam can be finely controlled in terms of energy, angle, and intensity, allowing users to tailor the milling process to suit their specific requirements. One of the key features of MICRION Vectra 986FC is its advanced imaging and targeting capabilities. The unit is equipped with high-resolution imaging tools, such as scanning electron microscopy (SEM) and focused ion beam (FIB) imaging, which provide real-time visualization of the sample surface during milling. This enables users to accurately position the ion beam and monitor the milling progress with sub-nanometer resolution. Moreover, Vectra 986FC offers a range of milling modes and techniques to accommodate various materials and applications. Users can choose between broad-beam milling for rapid material removal over large areas or focused ion beam milling for high-resolution patterning and detailed sculpting. Additionally, the machine supports cryogenic cooling and ion beam-assisted deposition processes, expanding its capabilities for diverse material processing tasks. In terms of automation and ease of use, FEI / MICRION Vectra 986FC is equipped with sophisticated software control and programming interfaces. Users can define complex milling sequences, set parameters for ion beam manipulation, and create custom milling recipes for repeatable and reliable results. The tool also features automated feedback mechanisms to ensure precise control over milling depth, uniformity, and surface quality. Furthermore, FEI Vectra 986FC is designed for versatility and scalability, with options for additional modules and accessories to enhance its functionality. These include gas injection systems for reactive ion milling, in-situ sample preparation chambers for multimodal analysis, and sample holders for handling various sample sizes and shapes. The asset can be integrated with other analytical tools, such as energy-dispersive X-ray spectroscopy (EDS) and secondary ion mass spectrometry (SIMS), to provide comprehensive material characterization and analysis. Overall, MICRION Vectra 986FC ion milling model stands out as a cutting-edge solution for high-precision material processing and surface modification. Its advanced features, imaging capabilities, and automation functionalities make it a powerful tool for research, development, and manufacturing applications in the semiconductor industry and beyond. By offering unparalleled control and flexibility in ion milling processes, Vectra 986FC enables users to push the boundaries of innovation in nanotechnology and materials science.
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