Used PHILIPS / FEI DB 830 #9121001 for sale
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PHILIPS / FEI DB 830 is a versatile ion milling equipment designed for advanced materials processing. It offers superior performance, accuracy, and reliability when performing a variety of tasks that involve removing material from the surface of a substrate. FEI DB 830 is designed with a source-target column that is capable of operating with a variety of ions, including Argon, Xenon, and Neon. It is equipped with a high ion energy source that is capable of delivering up to 8 keV and a rotary deflector for precise process control. The system is designed to operate in a vacuum environment and is powered by a high-voltage power supply. The primary application of PHILIPS DB830 is ion milling, which is a process used to shape and remove material from the surface of a substrate. The unit includes a milling chamber that holds the target, gun, and beam optics. A wide variety of milling trajectories can be programmed into the machine, allowing it to mill flat surfaces, curved surfaces, and complex 3D shapes. DB830 is also capable of performing etching, which is a process that involves selectively removing material from a substrate surface. Etching is performed by making use of the ion beam to create patterns on the substrate surface. The tool also features an auto-focus mode, which enables it to automatically refocus the ion beam when etching at different depths. A variety of accessories can be used with FEI DB830, such as a liquid nitrogen-cooled shield to protect the substrate from the ion beam, or a pulsed ion beam etching mode that enables faster processing times. The asset also features a wide range of beam filtration, allowing for precise control over the structure of the patterns that are created. In total, PHILIPS / FEI DB830 offers a comprehensive, highly advanced solution for materials processing. With its wide range of ion beam sources, powerful beam optics, and accessories, it is an ideal choice for any application that requires the removal of material from a surface.
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