Used SCIA SYSTEMS GMBH TRIM 200 #293828738 for sale
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ID: 293828738
Wafer Size: 4"-6"
Vintage: 2015
Ion milling system, 4"-6"
Vacuum chamber with pump system
Handling robot with cassette loading
Vacuum pre-aligner / Wafer ID reader
Neutralizer and (4) Axis systems
Wafer chuck with mechanical wafer clamping and helium backside
Control rack with electricity supply and control PC
Interface: SECS / GEM
RGA Integration
Gas channel
Handling unit: MX500 With (2) Load-locks
RGA Via ethernet
Manual control of RGA
Visual output of measurement
(14) Individuals masses: Alarm threshold / Tolerance
(14) Masses: Online / Offline trend
Gas piping 1/4" stainless steel with VCR fitting
Cabinet system frame
Hardware integration
SECS / GEM Integration:
Mass flow controller (MKS) / (2) Pneumatically operated valve
(7) Additional gas channels
Inert, 1/4"
RGA MKS HPQ3 S For process monitoring:
Power supply
GRANEVILLE PHILLIPS Micro gauge
Hardware:
MKS Instrument HPQ3S IP RGA
Controlled angle valve between process chamber
RGA To protect filament
Process chamber:
BROOKS MX 400 Handling robot
Axis system (X-Y-Z-Phi axis)
SECS II-SEMI E5-0706 (Standard)
GEM-SEMI E30-1103 (Standard)
Lower level protocol: HSMS-SS - SEMI E37-0303 (Standard)
Facility supply:
(3) Gas channels
Compressed air
Cooling wafer distribution
Handling platform:
BROOKS MX500 With (2) cassette load-locks
MX400 With load-lock
Wafer over (2) cassette load-locks
2015 vintage.
SCIA SYSTEMS GMBH TRIM 200 is an advanced ion milling equipment designed for precision material removal in semiconductor manufacturing, research and development, and other high-tech industries requiring nanoscale processing capabilities. As a leading provider of innovative ion beam processing solutions, SCIA SYSTEMS has developed TRIM 200 to meet the demands of cutting-edge applications that call for superior surface quality, uniformity, and control over the material removal process. SCIA SYSTEMS GMBH TRIM 200 ion milling system offers exceptional performance and flexibility, thanks to its state-of-the-art technology and advanced features. The unit is equipped with a highly efficient ion source that generates a focused ion beam for precise and controlled material removal. This ion beam can be configured with various ion species to match the specific processing requirements of different materials, ensuring maximum process flexibility and efficiency. One of the key highlights of TRIM 200 machine is its advanced automation capabilities, which enable high-throughput processing and efficient operation. The tool is equipped with a sophisticated software interface that allows users to easily program and control the processing parameters, such as ion beam energy, angle of incidence, and milling time. This automation feature not only enhances the asset's productivity but also ensures consistent and reproducible results for complex manufacturing processes. In addition to its automation capabilities, SCIA SYSTEMS GMBH TRIM 200 ion milling model offers a range of advanced process monitoring and control features to ensure precise and reliable material removal. The equipment is equipped with in-situ metrology tools that enable real-time monitoring of key process parameters, such as ion current density, beam profile, and material removal rate. This real-time feedback mechanism allows users to adjust the process parameters on-the-fly to achieve the desired material removal rate and surface quality. Furthermore, TRIM 200 system is designed with a high-precision sample stage that enables accurate positioning and alignment of the substrate during the milling process. This precise control over the sample position ensures uniform material removal across the entire surface, leading to high-quality results with excellent reproducibility. The unit also offers a range of sample holders and fixture options to accommodate various substrate sizes and shapes, making it suitable for a wide range of applications in the semiconductor and microelectronics industries. Overall, SCIA SYSTEMS GMBH TRIM 200 ion milling machine is a cutting-edge solution for high-precision material removal and surface modification applications. With its advanced technology, automation capabilities, and process control features, TRIM 200 offers users a reliable and efficient tool for achieving superior results in a variety of nanoscale processing applications. Whether used for semiconductor device fabrication, research, or prototyping, SCIA SYSTEMS GMBH TRIM 200 tool delivers exceptional performance and versatility to meet the evolving needs of the high-tech industry.
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