Used SEIKO INSTRUMENTS SMI 2050 #9228821 for sale

SEIKO INSTRUMENTS SMI 2050 is a high-quality ion milling equipment designed for the precise thinning and planarization of advanced semiconductor wafers. This particular model of the SMI series offers a unique combination of ion milling and laser-assisted reactive etching, making it a valuable tool for semiconductor fabrication facilities. SMI 2050's advanced ion milling technique uses inert gas atoms, at a high-energy speed, to remove extremely thin layers of material from the surface of thin film wafers. This process is useful for precise thinning, planarization, and profile modification of wafers, as it can be used to generate extremely precise features without any thermal damage. Additionally, the advanced laser-assisted reactive etching technique uses ultraviolet laser pulses to create extremely precise features, while also enabling the precise modification of existing features on the surface of a substrate. SEIKO INSTRUMENTS SMI 2050 ion milling system is composed of several innovative components. Its Digital Control Unit allows for highly precise control of the milling process, allowing the user to select the exact thickness of material to be removed and the exact layout profile to be maintained during the milling process. Additionally, the unit's Overhead Endstation allows for convenient access to the specimen during the milling process. Other components include an automated source exchange, a pulse power supply, and a cleanroom-compatible extraction/transport machine. SMI 2050 is designed to provide utmost safety and convenience to users, with its interlocked safety cover and special integrated software package, which offers complete control of the milling process. Additionally, the safety software allows the user to tune the ion milling process in real-time, to ensure high-precision results. Moreover, the tool is designed to be easily maintained and serviced, while its advanced asset monitoring capabilities provide instant feedback on the condition of the machine. Overall, SEIKO INSTRUMENTS SMI 2050 offers a comprehensive set of features that make it an ideal choice for use in semiconductor fabrication facilities. Its advanced ion milling and laser-assisted etching techniques make it effective for precise thinning and planarization of advanced semiconductor wafers. Moreover, its user-friendly design and wide range of safety features provide added convenience and confidence when operating SMI 2050. This, combined with its high performance, makes the model a reliable and effective solution for high-quality ion milling applications.