Used VEECO RF 350S #293791454 for sale
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ID: 293791454
Wafer Size: 8"
Vintage: 1999
Ion beam system, 8"
BROOKS AUTOMATION 003-9010-03
BROOKS AUTOMATION 001-2980-64
BROOKS AUTOMATION 001-7500-02 Robot
LEYBOLD HERAEUS TMP 260U Turbo pump
LEYBOLD HERAEUS TMP 260SG Turbo pump
LEYBOLD HERAEUS TMP 361C Turbo pump
Process module station 2:
Process: Ion beam etch
PFEIFFER / BALZERS TPH 2200U Turbo pump
RFPP RF20M RF Generator
SPELLMAN SL 1200 Power supply
SPELLMAN SL 300 Power supply
SORENSON DCS60-18E Power supply
SORENSON DCS600-1.75E PBN Power supply
MKS CT27A12TBC810 Pressure gauge
CONVECTRON Type 685
VAT 14048-PE44-AAL1/0014 Isolation valve
NESLAB HX-150 Chiller
Gas boxes:
Gas 1: Ar, 50 SCCM
Gas 2: O2, 50 SCCM
1999 vintage.
VEECO RF 350S is a state-of-the-art ion milling equipment designed for precision etching and material removal in the semiconductor, optics, and research industries. This advanced equipment combines cutting-edge technology with robust construction to deliver high-performance ion milling capabilities for a wide range of applications. VEECO RF 350 S utilizes ion beam technology to selectively remove material from the surface of substrates with high precision and control. The system generates a high-energy ion beam that bombards the surface of the sample, sputtering atoms and molecules to achieve precise etching and patterning. This process allows for the fabrication of ultra-thin films, smooth surfaces, and complex patterns with sub-micron resolution. One of the key features of RF 350S is its advanced RF plasma ion source, which enables precise control over ion beam parameters such as energy, density, and directionality. This allows for customization of the ion beam characteristics to suit specific material properties and etching requirements. The unit also features a high-vacuum chamber with precise temperature control to create optimal conditions for ion milling processes. RF 350 S is equipped with a versatile sample stage that can accommodate various substrate sizes and shapes, allowing for flexibility in sample preparation and processing. The machine supports both batch and single-substrate processing modes, enabling high-throughput manufacturing and research applications. Additionally, the sample stage can rotate and tilt to achieve uniform etching and coverage across the entire substrate surface. For precise process control and monitoring, VEECO RF 350S is equipped with advanced software and automation capabilities. Users can program and sequence ion milling processes, set parameters for ion beam energy and flux, and monitor real-time process data to ensure consistent and reproducible results. The tool also includes built-in safety features and diagnostics to prevent errors and optimize asset performance. In addition to its primary ion milling capabilities, VEECO RF 350 S can be equipped with optional accessories for enhanced functionality. These include in-situ metrology tools for real-time process monitoring, gas injection systems for reactive ion etching, and load-lock chambers for rapid sample exchange. These accessories further expand the capabilities of the model and enable a wider range of processing techniques. Overall, RF 350S ion milling equipment offers cutting-edge technology, precision control, and versatility for a wide range of applications in the semiconductor, optics, and research industries. With its advanced features, customizable ion beam parameters, and automation capabilities, RF 350 S is a powerful tool for achieving precise etching, thin film deposition, and surface modification with high accuracy and repeatability.
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