Used TEL / TOKYO ELECTRON CL-8300 UD #293642914 for sale

TEL / TOKYO ELECTRON CL-8300 UD is an advanced laboratory instrument designed for quality control and analysis of thin film surfaces. It is ideal for use in the semiconductor, flat panel display, and photovoltaics industries. TEL CL-8300 UD is capable of capturing true 3D images, allowing for characterization of both the top view and cross-sectional view of thin film surfaces. The equipment is equipped with an advanced control and analysis interface to provide easy and accurate data analysis. TOKYO ELECTRON CL-8300 UD features an integrated Optical Profiler system capable of capturing 3D images with nanometer resolution. The embedded high-resolution spectroscopic attachments provide an accurate analysis of top and cross-sectional thin film surfaces. The embedded Profiling Stage allows for precise alignment of thin films and is equipped with two motorized axis that provide smooth and precise movements. The unit is equipped with a high-sensitivity Imaging Machine and multiple imaging modes. The Imaging Tool features a High Sensitivity CCD Camera, capable of capturing both top view and cross-sectional images. In addition to this, the asset is also equipped with advanced spectroscopic attachments and powerful spectral analysis software for precise categorization of thin films. CL-8300 UD also features an advanced Data Acquisition Model, capable of collecting measurement data from multiple analysis stages with adjustable speed. This ensures accurate results and reliable analysis. Furthermore, the equipment is equipped with an intuitive software control interface for precise measurement control. In addition to these features, TEL / TOKYO ELECTRON CL-8300 UD is also designed for compatibility with multiple thin film analysis attachments and devices. This allows for precise characterization of a range of thin film surfaces, from organic thin films to partially crystallized structures. Overall, TEL CL-8300 UD is an advanced laboratory instrument designed for the precise analysis of thin film surfaces. It is capable of capturing true 3D images and providing precise characterization of both top view and cross-sectional thin films. The system is equipped with an advanced control and analysis interface as well as multiple imaging modes and spectroscopic attachments for precise categorization of thin film surfaces. The unit is also designed for compatibility with multiple thin film analysis attachments and devices, ensuring precise characterization of thin films.