Used LAURIER / DATACON / BESI Equipment for sale

Laurier, Datacon, and Besi are prominent names in the field of semiconductor packaging and die attachers. These companies have established a strong reputation in the industry due to their commitment to innovation, quality, and technological advancements. Laurier, a division of Ontario-based FDS Group, has been in operation since 1979. With more than four decades of experience, Laurier specializes in the design and manufacture of advanced die attach equipment. Their product portfolio includes various die bonders, epoxy dispensing systems, and flip chip bonders. Laurier's die attachers offer high precision and accuracy, enabling efficient and reliable attachment of semiconductor chips onto substrates. Datacon, a leading provider of advanced packaging equipment, was founded in 1970 in Landau, Germany. Acquired by Besi in 2016, Datacon has become an integral part of the Besi Group. Datacon's die attachers are renowned for their technology, versatility, and efficiency. These machines are designed to support various packaging technologies, including flip chip and multi-chip module assemblies. With a focus on quality and innovation, Datacon continues to provide cutting-edge solutions to meet the evolving needs of the semiconductor industry. Besi, short for BE Semiconductor Industries, is a Dutch multinational company that specializes in semiconductor assembly equipment. Founded in 1995, Besi has firmly established itself as a market leader in the industry. By acquiring Datacon and Laurier, Besi has strengthened its product offering in the field of die attach and advanced packaging solutions. Besi's die attachers integrate advanced features such as high-speed placement, precise control, and multi-die capabilities, enabling efficient and reliable chip attachment. In conclusion, Laurier, Datacon, and Besi are renowned names in the semiconductor industry, particularly in die attach equipment. Their products offer advanced features and technologies to enhance the semiconductor packaging process, ensuring high precision, reliability, and efficiency. With a strong history and commitment to innovation, these companies continue to play a vital role in the advancement of the semiconductor packaging industry. Their collaborative efforts under the Besi Group provide customers with a comprehensive portfolio of solutions for their die attaching needs.