Used ABM ABM/6/350/NUV/DCCD/M #9293272 for sale

ID: 9293272
Wafer Size: 2"-4"
Mask aligner, 2"-4".
ABM ABM/6/350/NUV/DCCD/M is a high-performance, state-of-the-art mask aligner for advanced semiconductor-manufacturing processes. It enables precise contact alignment between photosensitive material and a substrate, such as a wafer, with superior accuracy and repeatability. The mask aligner features a beam source of 350 nm wavelength, nanometer (nm) resolution and a dynamic-charge-control drive (DCCD) equipment for improved stability. ABM ABM/6/350/NUV/DCCD/M is capable of very precise alignment and pattern alignment to enable high-volume photomask production. This is achieved via programmed alignment software and controlled manipulation of the wafer by motorized stages. These motors are driven by a high precision motion control unit with a capacity to accurately position the wafer. The unit also includes a 6-inch (6") multi-layer optical system which enables superior imaging and alignment accuracy. This is further enhanced by the near-ultraviolet beam of 350 nm, which has been proven to significantly reduce process-induced stress on the device surface. This in turn decreases the incidence of substrate defects and improves yields. In addition, the aligner contains a dynamic-charge-control drive (DCCD) unit which further enhances precision, repeatability and accuracy. The DCCD machine works by reducing the position-tuning time, since it counters charge-based excitations caused by external interferences during the alignment process. ABM ABM/6/350/NUV/DCCD/M can be employed for complex and high-precision manufacturing applications. It is suitable for challenging semiconductor working environments, such as those involved in sub-micron feature sizes and advanced MEMS and NEMS processes. Overall, ABM ABM/6/350/NUV/DCCD/M is an excellent choice for high-grade semiconductor photomask production due to its highly accurate and repeatable alignment and imaging capabilities. Its robust design and improved precision further enhance yield and cost-reduction while maintaininig the highest level of accuracy.
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