Used ABM ABM/6/500/NUV/DCCD/M #293596008 for sale

An ABM ABM/6/500/NUV/DCCD/M mask aligner is a precision equipment that is used in the alignment process of Semiconductor Integrated Circuit (IC) fabrication. It typically consists of two main components: a wafer stage and a reticle stage. The wafer stage supports and aligns the wafer in its position prior to the alignment cycles. The reticle stage is responsible for the alignment of the photomask (or reticle) with respect to the wafer's alignment position. Both stages feature vacuum systems that suck the wafer or reticle down, providing a firm, stable foundation for the alignment process. ABM ABM/6/500/NUV/DCCD/M mask aligner is equipped with a collimation system, which consists of a beam splitter and two lenses, providing a collimated light source that is used to measure the angular misalignment between the wafer and the reticle. The alignment accuracy of ABM ABM/6/500/NUV/DCCD/M mask aligner is achieved with the help of a number of servo-motors running along the X-Y-Z axes. These servo-motors provide and maintain horizontal and vertical fine-level alignment accuracies of up to +/-0.5 micron. ABM ABM/6/500/NUV/DCCD/M mask aligner is powered by an Industrial PC with an advanced operating unit and individual software for controlling the entire alignment process, positioning and scanning. This enables the machine to position the wafer and reticle, measure the misalignment, and adjust or correct the alignment if necessary. Additionally, the PC platform also provides a networking capability for settings, monitors, troubleshooting and diagnostics. An optical machine consisting of two imaging systems and continuous UV light sources with arc-sensors are employed in ABM ABM/6/500/NUV/DCCD/M mask aligner. The imaging tool is used to capture the image of the reticle and wafer, while the arc-sensors measure their contact angle. This ensures a maximum accuracy of movement in the X-Y-Z axes with consistently low error rates. Additionally, ABM ABM/6/500/NUV/DCCD/M also includes a Dual Camera Control Device (DCCD), which is used to observe and compare the images of the reticle and wafer, providing a more reliable alignment result. ABM ABM/6/500/NUV/DCCD/M mask aligner is designed to provide superior accuracy in its alignment results. It provides a repeatability accuracy of up to 0.25 micron and its overall alignment accuracy is set to +/- 0.5 micron. This makes it a great choice for applications in cutting-edge semiconductor production lines. Furthermore, its advanced control asset, reliable optical model and easy networking make operation simple and efficient.