Used BROOKS AUTOMATION PRE-300-CE #9409371 for sale

ID: 9409371
Aligner.
BROOKS AUTOMATION PRE-300-CE is a mask aligner used in the semiconductor fabrication process. The aligner performs photolithography for the production of integrated circuit chips. It is the successor to BROOKS AUTOMATION 300-SF model and is a fully automated pre-aligned equipment designed to achieve accurate pattern transfer with repeatable, consistent results. The mask aligner consists of two major components, a Multi-Axis Stepping System (MASS) and an optical unit. The MASS is a six-axis robot that accurately positions the masks in alignment within a fraction of a micron. The optical machine is composed of a mask illuminator, light condenser, optical lens, and a wafer stage move. The optics are designed to provide optimal exposure uniformity, allowing the tool to achieve a high level of critical dimension accuracy. PRE-300-CE has a field size of 6-7 cm and a resolution of 0.5-5 microns depending on the corrected optics used. The asset features a 0.5/1.0 NA illuminator for exposure uniformity, low energy band optical exposure, and improved processing latitude. The mask illuminator is optimized for 365nm and has built-in exposure modulation for improved exposure control time. It uses an I-line lamp for exposure, with a powered bipolar voltage modulator for optimized control of the exposure dose across the exposure field. The aligner features automatic batch processing with a built-in memory capacity of 150 masks, which can be individually programmed and stored. The model supports both positive and negative exposure as well as die-to-die and die-to-image registration. It has automated calibration and beam monitor capability, providing fast and accurate alignment of mask patterns to wafers. BROOKS AUTOMATION PRE-300-CE is designed for efficient operation and ease of use with an easy-to-use graphical user interface. The equipment is equipped with a complete tool set for integration into large volume and high throughput production environments. It is compatible with a variety of substrates, including Si, GaAs, InP, and SOI, making it well suited for a wide range of semiconductor applications.
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