Used CANON 501 F #68942 for sale

CANON 501 F
Manufacturer
CANON
Model
501 F
ID: 68942
Wafer Size: 2"-6"
Aligner, 2"-6" Auto feeder (or) FA auto alignment (or) manual feeder.
CANON 501 F is an automated mask aligner used in the fabrication of integrated circuits, where it is used to precisely align the patterns of a photomask with those of a photoresist-coated wafer or other substrate. The aligner is capable of positioning the mask correctly to an accuracy of a few nanometres. 501 F is capable of positioning the mask and the wafer at both X and Y axes. A vacuum frame holds the wafer in place as it is translated by three micromotors which can be moved in the X and Y directions, with the help of encoders that track the movement. The three motors can be externally controlled for different alignment procedures and for varying ranges of motion. To accurately align the mask and the wafer, a laser is used to calculate the distances from the markers on the substrate's surface. The laser is placed on the substrate and projected onto the mask to measure the distance and calculate the alignment value. Another feature of CANON 501 F is its ability to perform precise alignment adjustment using a feedback process. 501 F features a built-in pneumatic shutter to protect the mask and wafer from dust particles and other contaminants. The pneumatic shutter is fully automatic and can be opened and closed rapidly. The machine is also equipped with a UV illumination lamp, which is used to check the quality of the alignment. An on-board monitor allows the operator to check the alignment results. CANON 501 F is equipped with a two-dimensional motor control equipment, which allows for high speed alignment of the mask and wafer. The motor control system is accurate and its response time fast. The unit is also able to perform positioning repeatability for close alignment tolerances. This machine is also capable of carrying out continuous alignment to ensure alignment accuracy throughout the process. 501 F is used for alignment of masks for metal layers, polysilicon layers, and other layers that are used in ICs. The machine is used in the fabrication of chips, such as the application processor, memory chip and the display controller.
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