Used CANON MPA 500 Fab #17950 for sale
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ID: 17950
Wafer Size: 4-5
Mirror projection aligner, 3"-5"
Auto feeders:
Single
Cassette to cassette
Backside wafer handling
Mask size, 4"-6"
Illumination: High pressure mercury lamp, 2 KW
Intensity: > 600 mW / cm2
Illumination uniformity: + 3%
Aperture sizes: 1.0, 1.1
Exposure uniformity: + 3%
Resolution: 1.5 μm
Depth of focus: > 6 μm (Line width 1.5 μm)
Magnification: < 0.4 μm (3 sigma)
Distortion: 3 sigma < 0.5 um
Scanning accuracy: < 1.5%
Auto alignment accuracy: LBS AA 3 sigma < 0.6 um (He Ne laser beam scan)
Throughput, 6”:
83 wfs/h (First mask mode)
72 wfs/h (LBS AA Mode).
CANON MPA 500 Fab is a fully-automated, high-performance mask aligner used for photolithography and microfabrication processes. It is designed for precision and accuracy, allowing for reliable reproducibility of devices and processes with a high degree of repeatability. CANON MPA 500FAB is designed specifically for the fabrication of high-quality image patterns on substrates such as silicon, quartz and glass. The unit offers high exposure resolution ranging from 1um to 5um, as well as an optical alignment equipment that provides precise alignment of mask and substrate pattern. The unit's exposure system also ensures consistent, uniform results on each sample. MPA-500FAB comes with a standard X-Y scanning table designed for rapid alignment of substrate and mask. The unit can align masks with measurements as small as 200nm, making it suitable for fine-line pattern applications. The machine also has a comprehensive range of control precision exposure, including shutter control, shutter of exposure light source, pulse width modulation and direct control exposure light source output. CANON MPA-500FAB offers a variety of features for fine patterning and fabrication. For example, the unit is equipped with exposure level control circuits that enable precise leveling and orientation of the exposure light source. Furthermore, the unit allows for exposure of metals and other high-contrast materials, with exposure intensities of up to 5x compared to the traditional exposure methods. MPA 500FAB has the unique capability of adapting exposure patterns to substrate patterns in order to reduce the number of exposure shots required for patterning. This feature allows for increased throughput, improved yield and cost savings. The unit also offers a variety of software functions, including mask editing, edge detection, substrate surface inspection and image evaluation. These functions provide reliable and precise results, even in large-scale processes. In summary, MPA 500 Fab is an ideal choice for high-speed, high-quality mask aligner for photolithography and microfabrication processes. The machine offers precise control and a wide range of features ideal for fabrication of fine patterns on various substrates. It also offers a number of software functions to simplify process workflow and optimize time and cost savings.
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