Used CANON MPA 600 FA #190737 for sale

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Manufacturer
CANON
Model
MPA 600 FA
ID: 190737
Wafer Size: 4"-6"
Aligners, 4"-6" Mask sizes: 5”-7” Resolution: 1.5 um (Using positive resist) Illumination: High pressure mercury lamp: 2 kW Wavelengths: 365nm (I-Line), 405nm (H-line), 436nm (G-line) Intensity: (@ 1800 Watts power output) >700mW, 4" >650mW, 5" >600mW, 6" Intensity / Exposure uniformity: Within ± 3% CTC: Monitors and controls system temperature within ±3°C PDC: Provides fine distortion compensation Automatic alignment: HeNe (633nm) Laser beam scanning Alignment modes: Spot beam / Sheet beam Accuracy: 3 Sigma <=.54 um MPA-600 FA: 200 VAC, 3-Phase, 6 kVA, 50/60 Hz Air supply (CTC): 200 VAC, 3-Phase, 8 kVA, 50/60 Hz CDA (Clean dry air) Pressure: Flow rate 130 lit/min Vacuum: >50 cmHg Exhaust flow (For illuminator): 6.5 m/sec - 9.5 m/sec (Measured at illuminator output).
CANON MPA 600 FA is an automated mask aligner that is used to produce integrated circuits (ICs) with the highest possible quality. The high-precision equipment allows for great accuracy and repeatability. It is equipped with a 6-inch slit field projection aligner, a long-life ion beam source, and a high-resolution photo-target. CANON MPA600FA has a slit field projection aligner that enables accurate, repeatable, high-precision alignment between the lithography mask and the target substrate. This ensures the highest possible register accuracy and fidelity during the printing process. The system also has a long-life electron beam source which allows for clean and reliable lithography in the 200mm IC production process. MPA-600FA also incorporates a photo-target to measure alignment parameters with superior accuracy and repeatability. The electron beam lithography unit works at very high speeds and allows for process tracks down to 110 µm as well as mask placement accuracy of up to 0.1µm. The unit also has an integrated optical video machine for easy setup, alignments and maintenance. CANON MPA 600FA features a variety of user-friendly features such as four programs that allow users to store up to four different types of mask-wafer alignments. The tool also comes with advanced data processing capabilities, providing users with real-time metrics for process performance. A built-in statistical review graph also allows for quick data analysis and fine-tuning for FABs requiring the highest degree of process control. Overall, MPA 600 FA is a recognized leader in lithography production with its extremely high-precision IC production capabilities. The long-life ion beam source, the high-resolution photo-target, and the speed and accuracy of the alignment make it the leader in reproducible integrated circuit production within the semiconductor industry.
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