Used CANON PLA 501 F #163560 for sale

CANON PLA 501 F is a high-precision, cost-effective mask aligner for submicron lithography. It is designed to provide excellent imaging quality and high yields for small structures even in the presence of small misalignment errors. The equipment features a highly efficient image exposure system that produces high resolution exposure of the pattern to be aligned and transferred, allowing for high precision of the submicron lithography process. The exposure unit utilizes an advanced optical exposure head that automatically optimizes the projections of the patterns. This includes the tilt of the beam, the magnification of the exposure, and the exposure area. The exposure level and image quality is further enhanced with the optimized pupil-conjugated optics located in the exposure head. The accurately designed optical aligner performs precise alignment and registration of the patterns with minimal misalignment errors. By utilizing an advanced resist monitor, the machine can compensate for para-axial and/or pattern transformation effects. Additionally, the tool includes an alignment asset, which is equipped with a unique piezo translator that allows high accuracy alignment. To further enhance the accuracy, the model includes an automated alignment optimization equipment (AOS) which utilizes a dedicated image processor to determine the best possible registration alignment. The mask aligner also includes a high-precision alignment system, which can support the highest accuracy of 0.25 micron alignment. This high-accuracy alignment feature enables better transfer of the mounted device patterns to the substrate, producing better yield and finer patterns with high resolution reproduction.The unit can also be used for parallel processes, which can enhance throughput and reduce cycle time for submicron lithography processes. CANON PLA-501F features improved ergonomics and automation with faster operation. It also comprises a built-in fan-unit to reduce the dust particles, resulting in better alignment and no further manual cleaning of the aligner. Additionally, the machine offers multiple software functions that can be conveniently configured to store the lithographic information. This can help the user to quickly prepare for the process and minimize the lead time. In conclusion, PLA 501F is an excellent choice for submicron lithography that provides precise alignment accuracy, satisfactory image quality and improved automation. It offers a cost-effective solution that produces high yields with minimum misalignment errors.