Used CANON PLA 501 FA #9162217 for sale

CANON PLA 501 FA
Manufacturer
CANON
Model
PLA 501 FA
ID: 9162217
Vintage: 1985
Mask aligners 4” Sapphire 1985 vintage.
CANON PLA 501 FA is a die-bonding and bonding tool used in the semiconductor and electronics industry. The machine is a mask aligner which provides electronic component assembly and die-bonding technologies through the use of precision tooling and alignment preparation. CANON PLA-501FA has numerous features to provide precise and efficient placement of dies and components. The electric wafer stage has a 25 cm space, which allows for larger wafer sizes. The mask and the die stations both have precision alignment systems. This allows the precision application of dies and components over various surfaces. The bonder station is equipped with a high-precision XY stage and powerful, yet adjustable, vacuum force to ensure optimal placement of dies and components. The stage is programmed to be able to reposition itself for additional work. In addition, its high accuracy makes it suitable for CSP (Chip Scale Package) and Flip-Chip assembly. The aligner has an air pressure module with a 7-point auto-focus equipment. Its auto-focus system is used to adjust the alignment accuracy and parameters of the machine. The auto-focus unit allows for a wide range of parameters for customer-driven process. The exposure station has an 8-point alignment machine with a 6.5-inch exposure window. It is user-adjustable for different types of exposure methods such as laser or UV exposure. In addition, it has a feature that sets the depth of the exposure window to the same level for repeatable setup. The machine has a software tool which allows users to access a wide range of capabilities. The software is highly customizable with the ability to build custom functions and profiles for the aligner. This allows it to be tailored to specific device assembly needs and product layers. PLA 501FA is designed for high efficiency and accuracy. It is a robust, reliable and strong solution for die-bonding and assembly needs of the semiconductor and electronics industries. Its precise and accurate performance make it suitable for challenging tasks that require excessive workloads and tight tolerances.
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