Used CANON PLA 501 #293615023 for sale

Manufacturer
CANON
Model
PLA 501
ID: 293615023
Wafer Size: 3"-4"
Mask aligner, 3"-4" Spare parts Does not include automatic wafer handling system.
CANON PLA 501 is a high precision and fully automated 5-inch Mask Aligner Equipment used for both backside as well as frontside die attach of components in the microelectronics industry. It is used for fine pitch and high alignment accuracy when mounting dies to a package, circuit board or wafer. CANON PLA-501 aligner is equipped with a large number of automated components and features, allowing for a very accurate and consistent result. These features and components include a highly accurate 12.7mm (1/2 inch) slide linear stage, a flexure stage, stepper motor, laser head, CCW tilted LCD monitor, automated stage movement of up to 13-inch along the X, Y and Z axes, a 5 inch mask holder, vacuum pump and optical system. PLA 501 mask aligner is also capable of ultra-low magnification imaging, as well as autofocus, making it ideal for ultra-fine pitch requirements. The adjustment of the image on the mount table is possible using the highly sensitive stepper motor movement during image acquisition, to enable precise and accurate alignment of the die to the target location on thepackage or board. The mask aligner's fully automated stage, controlled by dedicated software installed on a Windows-based PC, allows flexibility and overall unit performance. The automation feature of this machine enables real-time image monitoring and processing with scanning algorithms for faster alignment and positioning. Finally, PLA-501 Mask Aligner is equipped with a high quality infrared heating machine to maintain a uniform temperature across the platen as well as across the X, Y, and Z axes of the optical tool. This helps ensure consistent die attach quality while avoiding possible thermal damage to the component. It also has an in-built pressure monitor asset, can detect and measure pressure during die attach process to minimize damage to component caused by over pressure.
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