Used CANON PLA 600 FA #9026887 for sale

CANON PLA 600 FA mask aligner is a highly precise photolithography equipment used in the production of semiconductor integrated circuits. It is designed for simplicity of use and highest accuracy, supporting a wide range of substrates from 180mm to 200mm in size. The system achieves high accuracy by using a precise laser pattern generator that is mounted on the same X-Y stage as the substrate. This ensures that alignment across the entire substrate is possible. It also enables global-shifting and high-precision pattern size adjustment on all substrates. Mask alignment and exposure is achieved with a high-quality Scanning Ion Beam (SIB) technique, optimizing the balance between overlay accuracy and throughput. The unit uses a diffraction mask to achieve the required alignment and exposure in a single run and incorporates a pulse laser power adjuster for much sharper features on the surface of the substrate. An advanced optical sensor machine is integrated to ensure direct alignment accuracy of 1μm and overlay accuracy of 2μm. The tool also uses various advanced technologies to process photo-resist films in a fraction of the time required by traditional methods. This includes an advanced ultraviolet light source with an adjustable shutter asset for accurate exposure control; and a multi-point beam scanning model for auto-adjustment and auto-focus. The equipment is integrated with a range of digital automation features such as FOUP (Front Opening UNPlease) loader for maximum transport capabilities; an auto-tilt/shift to adjust tilt & shift for pattern repeatability; and a nozzle-centring device for changing process environments. CANON PLA-600FA is ideally suited for the production of high density and semiconductor devices, with features such as extended programmable exposures. The system provides highly accurate results and a fast turnaround, reducing production time and increasing productivity.