Used CANON PLA 600 FA #9152979 for sale

CANON PLA 600 FA is a mask aligner ideal for wafer-level photolithography. It helps to rapidly fabricate patterns and structures in high yield for applications in areas such as MEMS, nano-electronic devices, and optoelectronics. This machine offers stitching of rectangular images up to 24 mils, with a minimum feature size of 0.14 mils. It features TTL laser diode beams, wafer positioning via an X-Y indexer, and critical alignment which is capable of 4-axis rotation plus centricity measurements of patterns on the wafer. CANON PLA-600FA has a 24-position auto-load/unload holder and is capable of handling 6" to 8" wafers. The wafers can be up to 200mm thick. The imaging machine uses highly sensitive 32-bit LSI colors, with masks generated on a special 800-dpi photosensitive tile. This ensures very high resolution with low line width spread. This machine is available with a Graphical User Interface, which operates on an Intel-based platform and features a 19" monitor and PC-based software. The software is user-friendly, and allows for easy set-up and control of the mask aligner. In addition, PLA 600FA provides peripheral devices such as automatic slitters, drying ovens, and hot stage chuck tables. This machine also offers flexible vacuum chuck wafer handling of multiple wafers from thin to thick types to flat and curved. Furthermore, it is able to handle wafer substrates of various compositions, such as silicon, low-k, nitride, phosphosilicate glass, and gallium arsenide. PLA-600FA is also equipped with a state-of-the-art laser bi-directional scanning so that image distortions can be easily compensated. Furthermore, it features several user-friendly automatic functions, such as auto-positioning, auto-focus, and auto-exposure. Overall, PLA 600 FA is an ideal mask aligner for fabricating patterns and structures in high yield for applications in MEMS, nano-electronics, and optoelectronics. It boasts of highly advanced features such as laser bi-directional scanning, various wafer substrate composition handling, 32-bit LSI colors, high resolution imaging, user-friendly Graphical User Interface, and several automatic functions.