Used CANON PLA 600F #293830592 for sale

Manufacturer
CANON
Model
PLA 600F
ID: 293830592
Wafer Size: 2"-6"
Mask aligners, 2"-6" Photo mask size: 2.5", 4", 5", 6", 7" Illuminator: Lamp: 250W super high pressure mercury lamp Uniformity: +/-3% / D150 mm Exposure time setting: Light integration method (Switch setting from 0.1 to 59.9) Exposure time: 5 sec for positive resist (AZ 1470), 2 sec for negative resist (OMR 83, using, ND-50 filter) Alignment scope: Objective lens: 10x (5 x, 20 x) Zoom erector: 1 x-2.5x Eyepiece: 10 x (15 x, 20 x option) Field of observation: image Scanning range X/Y direction: +/- 10 mm joystick Alignment method: Auto alignment (PLA-600FA): +/-0.5, +/-1.0, +/-2.0 ILm Tolerance setting: Key patterns for auto alignment Offset control: (0-7.9 ILm in 0.1 ILm units, 0-791Lm in 1 ILm units) Alignment mode: Auto, semi-auto and manual.
CANON PLA 600F is a Mask Aligner machine used for various semiconductor and microelectronic chip manufacturing processes. The machine is designed as a vertical-aligned equipment, where the substrates are mounted onto a stage, which is then moved vertically in relation to a mask or reticle. It can process wafers up to 6 inches in diameter, with a typical processing time of 30~60 minutes per wafer. CANON PLA600F has an exposed platen and is equipped with a low-energy-scattering pre-aligner system. This unit accurately aligns the mask with the substrate, even with misalignments of up to 3µm. It is also designed to protect the substrate from potential damage during alignment, as well as keep a clean and debris-free working environment. PLA-600F has a two-axis scanning machine and is capable of operating in various modes, so as to accommodate a wide range of processes. The scanning direction, scan rate and exposure intensity can be adjusted to accommodate different process parameters. The machine is also equipped with an automatic exposure tool, which allows for precise exposure control to ensure process uniformity and accuracy over a range of image sizes. In terms of illumination optics, CANON PLA-600F can accommodate a range of lenses, with a choice of Microscope Objectives, Macro Objectives and Field Objectives. This wide selection of lenses enable the machine to accurately align substrates of different sizes and shapes. Also incorporated within the asset is CANON Sensor Array Model for advanced illumination uniformity control. This equipment can work to control the uniformity of marginal illumination and substrate exposure times. CANON PLA-600 F also features a CLASS-SEV Vacuum system which keeps the substrate held firmly in place on the stage during processing. The unit also ensures a clean, debris-free vacuum environment. The machine's stage is also very easy to use and can be adjusted through a simple and intuitive user interface. In summary, PLA-600 F is a versatile and accurate Mask Aligner machine that is capable of processing a range of different processes. It is equipped with a range of lenses, a Sensor Array Machine and a CLASS-SEV Vacuum tool, which all ensure accurate alignment, illumination uniformity and cleanliness. The easy-to-use user interface makes this machine easy to use, helping to ensure smooth and efficient production.
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