Used EVG / EV GROUP 610 #293615268 for sale
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ID: 293615268
Mask aligner
Wafer thickness: 0.1 mm to 10 mm
Exposure area, 6"
Uniformity: < 4%
UV Intensity meter with prober: 365 nm
Alignment capability:
Topside alignment: <0.5 µm
Bottom side alignment: <1.0 µm
LED Light source:
G, H, and I-Line wavelengths
Modes:
Constant power
Constant intensity
Constant dose
Constant time exposure modes
Exposure modes:
Vacuum contact
Proximity contact
Hard and soft contact
Alignment stage:
Precision differential micrometer spindles
Motorized Z-axis
WEC Adjustable and exposure contact force
Top side microscope:
Manual split field
Resolution visible light CCD Camera
Digital zoom: 2x and 4x
Travel range:
X: 32 mm-150 mm
Y: -75 mm / 30 mm
Bottom side microscope:
Manual split field
Resolution visible light CCD camera
Digital zoom 2x and 4x
Travel range:
X: 8 mm-100 mm
Y: ±10 mm
Mask holder:
Size: 5" x 5"
Exposure: Round opening
Bottom loading with automated vacuum transfer
Mask loading frame mask, 5"
Vacuum contact wafer chuck:
Manual load with pre-alignment aid
BSA: Windows
Hard coated and lapped
Vacuum contact seal for wafers to thick: 1.5 mm.
EVG / EV GROUP 610 is a state-of-the-art mask aligner for photolithography. This mask aligner is well suited for modern high-precision applications. It offers a highly accurate, rapid, and repeatable photolithography process which is capable of consistently producing fine-line resolution patterns with the best alignment repeatability in the semiconductor industry. EVG 610 has a modular architecture which allows users to customize the machine for their specific production requirements. It has a top-down 6-inch working area so that substrates can be processed up to 50 mm thick with a large planar field of view. The precision stage also offers a scanning range of 2000 x 1000 μm² and a resolution of 1 nm. The motorized Z-axis ensures optimal parallelism between the mask and substrate at all points, and the high-resolution optical system allows for a magnification of up to 1000x and a working distance controlled with a high accuracy of ± 1 μm over the full field of view. EV GROUP 610 has a number of features that make it suitable for a wide range of applications, including photoresist exposure, alignment and etching, nanoscale patterning, and layer registration. It supports both UV and DUV lithography and a variety of exposure sources, from xenon lamps to ArF lasers. Additionally, the machine is fully integrated with a variety of pattern generators, exposure heads, and exposure source controllers for complete automation of photolithography processes. This mask aligner is easy to use and requires minimal operator intervention. It has a user-friendly touchscreen interface, making it easy to program and monitor photolithography recipes and processes. It also offers advanced control and feedback functions to provide optical and process control data in real time. 610 can be integrated with other photomask fabrication solutions, allowing users to develop automated multi-life-cycle solutions. In conclusion, EVG / EV GROUP 610 is a highly accurate, versatile and user-friendly mask aligner, making it an excellent choice for photolithography applications. This machine offers a wide range of features and capabilities, offering users outstanding performance and repeatability for their photomask fabrication needs.
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