Used EVG / EV GROUP 610 #9197737 for sale

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Manufacturer
EVG / EV GROUP
Model
610
ID: 9197737
Bond alignment system Manual bond aligner Bottom side alignment (BSA) Manual alignment Wafer capable: Up to 6"/150 mm Set up for 4" wafers Tooling (Chuck) Tooling exchanges are quick Microsoft windows based user interface System PC Keyboard Cables Operations manual.
EVG / EV GROUP 610 is a state-of-the-art precision mask aligner used in the lithography process. It is specifically designed for the production of advanced photomasks and reticles used in photolithography, specifically for next-generation processing nodes. These mask aligners use a double-shutter, lithography-based equipment to achieve a patterning accuracy of ±1nm. EVG 610 also features a unique combination of mechanical, electrical, and software components to provide precise alignment and repeatable process results. EV GROUP 610 features an advanced optical system featuring a diode laser unit that uses multiple, selectable laser wavelengths and power levels for high resolution and accuracy. This makes it ideal for production of photomasks and reticles at the most advanced nodes. The laser also allows for high-precision alignment and registration even when using advanced photomasks with overhang structures. Additionally, 610's laser is highly robust, with a low reflectivity, making it ideal for production of a variety of photomasks. EVG / EV GROUP 610 also features an automated substrate handling machine, which allows for efficient alignment and processing of wafers. This includes an automated feeder and an optional automatic substrate loader, making it ideal for production needs. The servo-controlled wafer and reticle stages provide ultra-high accuracy and precision with 1.5nm repeatability. The stages also feature advanced motion control algorithms for optimized part movement and a motorized roll compensation module for precise part placement. EVG 610 features a versatile exposure tool, which includes a high-accuracy, fixed-position UV projection asset. This model ensures precise and repeatable registration for high-accuracy lithography applications. EV GROUP 610 also provides a fully automated exposure control equipment with integrated pattern recognition algorithms for fast and reliable operation. Finally, 610 features advanced wafer tracking and monitoring capabilities including an integrated 0-segment CCD camera system. This integrated unit features advanced defect recognition algorithms and integration with downstream process tracking systems. Additionally, an optional software package is available with advanced features such as 3D optimization algorithms, enhanced defect recognition capabilities, and process monitoring. Overall, EVG / EV GROUP 610 is a top-of-the-line mask aligner with advanced features for high-precision lithography processing. The combination of optical, mechanical, electrical and software components makes it ideal for production of the most advanced photomasks and reticles. Additionally, the automation machine and defect recognition capabilities enhance process efficiency and provide repeatable, reliable results.
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