Used EVG / EV GROUP 620 #9157253 for sale
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ID: 9157253
Vintage: 2003
Bond aligner, 6"
Wafer thickness 0.1-4.4 mm with total stack of thickness of 4.5 mm
Semi automatic loading with mechanical prealignment
Quick change of chuck with automatic pressure and vacuum transfer
Alignment accuracy: +/- 1 um with high process objectives
Alignment stage:
Fully motorized X, Y, Theta and Z alignment stage alignment via 3 axis joystick
Automatic wedge compensation with air bearing precision stage
WEC contact force from 1-30 N adjustable, no shift between wafers
DC Motor controllers for cursor key fine alignment
Bottom side microscope, MS241:
Motorized split-field microscopes for alignment in visible light with CCD cameras
Bottom side alignment via digitized alignment keys (mask) or crosshair
Travel range: X: 30-100 mm, Y: +/- 12 mm
CCD Camera (604 x 575 pixels)
(2) 20x Objectives
(2) 10x Objectives for flat and chip alignment:
Minimum distance (optical axis) of 8 mm
Suitable for top or bottom side microscope
Bond tool 20 mm x 20 mm universal (set):
For thermo compression bonding process
Bond chuck with mechanical clamping
Loading chuck
Bond glass
Stainless steel pressure insert included in 4" tooling
Stainless steel pressure disc
Bond tool 70 mm x 70 mm universal (set):
For thermo compression bonding process
Bond chuck with mechanical clamping
Loading chuck
Bond glass
Stainless steel pressure insert included in 4" tooling
Stainless steel pressure disc
Bond tool 4" universal (set):
For anodic and thermo compression bonding process
Bond chuck with mechanical clamping
Loading chuck
Bond glass
With electrode and glass pressure insert
Stainless steel pressure insert for TCB
Separation flags
Stainless steel pressure disc for TCB
Bond tool 6" universal (set):
For anodic and thermo compression bonding process
Bond chuck with mechanical clamping
Loading chuck
Direct wafer clamping
With electrode (glass pressure insert included in 4" tooling)
Separation flags
Stainless steel pressure disco for TCB
Loading chuck 4" for wafer and shadow masks:
For loading and alignment
For autoloading with through holes
Recess for clamps
Remains on EVG 620 shadow mask aligner
Chuck frame 4" for wafer and shadow mask:
For fixing insert
Recess for clamps
Supports the insert to hold the alignment stack
Remains on EVG 620 shadow mask aligner
Shadow mask / wafer holder with 4" clamps:
For clamping substrates
Includes:
clamps used to carry aligned
Clamped stack to further processing
2003 vintage.
EVG / EV GROUP 620 is an advanced mask aligner that is capable of delivering superior levels of alignment accuracy. This machine utilizes an advanced imaging technology combined with a precise control algorithm and a modular platform to optimize performance. With its fully automated process, the mask aligner guarantees a high-level accuracy of up to 5 microns, making it ideal for production of highly challenging designs and subsequent lithography steps. EVG 620 offers a high resolution imaging system that is capable of taking images with a size range between 20 to 6000 microns, allowing for precise imaging and accurate alignment for a wide variety of mask types. In addition to the precise imaging technology, the machine comes with user-friendly features and functional controls that allow users to adjust its parameters, such as exposure time, illumination levels, and focus position. To ensure that parts are properly exposed, EV GROUP 620 utilizes a special motorized stage that allows for a high level of precision when it comes to placement of substrates. The machine is equipped with an advanced, repeat alignment capability that helps ensure that parts remain consistent with the intended pattern. Additionally, the system can be equipped with an optional particle filter to help reduce contamination during the exposure process. For fabrication and maintenance of the mask aligner, the machine possesses a removable nozzles and electronic control package that provide access to various modules. It can accommodate a wide range of lithography materials and processes, ensuring its compatibility with a range of substrates. Furthermore, the machine is also equipped with both open and closed cycle process options, which makes it an ideal choice for production of any size wafer fits. In conclusion, 620 provides an advanced and reliable mask aligner for production of highly challenging designs. With its high accuracy and repeat alignment capabilities, the machine allows for a precision imaging process and easy maintenance. Its user-friendly features and wide range of compatible processes make it suitable for any size wafer fabrication. Ultimately, the machine is an efficient solution for achieving optimal lithography performance.
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