Used EVG / EV GROUP 620 #9189243 for sale
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ID: 9189243
Double sided mask aligner, 2"-6"
Top side microscope
Bottom side microscope
500W Lamphouse: 365 / 405nm
Wafer chuck, 5"
Mask holder: 6"x6"
Thickness:
Mask aligner: 0.1 - 10 mm (Max 2 mm for bottom side alignment)
Bond aligner: 0.1 - 3 mm for each wafer or substrate
Max stack height: 4.5 mm
Mask parameters:
Size: Max 7"
Thickness: < 6.35 mm
Throughput:
Up to 100 wafers/hour (Aligned)
up to 130 wafers/hour (First print)
Alignment:
Range of alignment: X, Y ± 5mm
Rotation: Theta ± 3°
X, Y, Theta axis resolution: 0.1 µm
Alignment accuracy:
Mask aligner:
Down to ± 0.5 µm for top side alignment
Down to ± 1 µm for top to bottom side alignment
Bond aligner:
Down to ± 0.5 µm for glass / silicon
Down to ± 1 µm for silicon / silicon
Handling system:
Three axis robot, 4"-6"
Cassettes:
Send
Receive
Reject
Robot accuracy: ± 25 µm
Accuracy of pre-alignment station:
X: ±50µm
Y: ±50µm
Theta: ±0.09°
Separation / Proximity adjustment:
Separation: Max 1000 µm adjustable in 1 µm steps controlled by software / microprocessor
Contact force: Mask and substrate for wedge compensation
Mask aligner: Adjustable from 0.5 - 50N
Bond aligner: Adjustable from 1 - 50N
Printing resolution: (350 - 450 nm) •
Vacuum contact: Down to 0.6 µm
Soft contact: Down to 2.0 µm
Hard contact: Down to 1.5 µm
Proximity: Down to 3.0 at 20 µm gap
Monitor / Camera: High resolution between CCD camera and TFT monitor
Lamp house:
Standard NUV: 350 - 450nm
Standard lamp power for 350W, 500W or 1000W
UV Light uniformity:
100mm: ± 2%
150mm: ± 4%
Intensity: (Measured at 365nm)
350W: 15 - 20 mW / cm2
500W: 20 - 25 mW / cm2
1000W: 40 - 45 mW / cm2
Applied industry standards:
NRTL
Semi S2, S8 certified.
EVG / EV GROUP 620 is a manual mask aligner designed for advanced photolithography applications. It has a large stage size of 600 mm x 500 mm with a mask size of 611 mm x 505 mm, making it suitable for production quantities up to medium-sized runs and a variety of substrates including silicon, quartz, glass, and polyimide. The advanced features of EVG 620, including the user-controlled manual stage, high-precision motorized Z-axis, the 4-way wobble, and a pressure screen, make it well suited for advanced optical alignments, critical alignment tasks, and even fine-line lithography. EV GROUP 620 Aligner is equipped with high accuracy automated registration and several innovative features that ensure optimum throughput and long-term repeatability, such as pixel edge detection, finger image contrast, and cross-link scanning. The system's accuracy specifications of ±3.1 µm in X and Y, and ±1.05 µm in Z, make it possible to achieve excellent lid-to-lid overlay accuracy with alignment times as short as 60 seconds. 620's user-controlled stage allows for precise manual alignment at any position, while its high-resolution motorized Z-axis ensures high accuracy and efficient repeatability when performing fine-line patterning tasks or alignment of small features. EVG / EV GROUP 620 also features a unique multi-axis wobble that compensates for heating effects and helps to reduce load variation. This user-controlled 4-axis wobble, combined with the motorized Z-axis, ensures fine alignment accuracy even when the substrate is tilted or not fully parallel with the alignment surface. EVG 620 is also designed to accommodate a pressure screen, allowing processes such as cleaner alignment, full-field alignment, and liquid crystal alignment to be carried out quickly and accurately. Furthermore, EV GROUP 620 is designed with versatility in mind and is capable of handling the most demanding customer requirements. It is an extremely reliable performer with excellent overall performance, making it the perfect choice for demanding alignment and critical lithography applications.
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