Used EVG / EV GROUP 620 #9227524 for sale

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Manufacturer
EVG / EV GROUP
Model
620
ID: 9227524
Wafer Size: 6"
Mask aligner, 6" Top side alignment Large gap alignment Separation distance: 0-300 µm Wafer thickness: 0.1-10 mm Semi automatic loading With mechanical pre-alignment on chuck Storage rack: (5) Aligner tools PC Controlled environment Solid state drive Hard drive Graphical User Interface (GUI) User interface: Keyboard and monitor Large gap alignment: Lamp house: 350 W / 500 W / 1000 W Light integrator for lamp control Light uniformity: 100 mm: ± 2% 150 mm: ± 4% Optical set wavelength range: 350-450 nm Dielectric mirror Field lens, 6" Lamp: 500 W Manual filter changing unit Without filter / Carrier Filter carrier with manual filter changing unit: Carrier with narrow band filter: 365 nm (i-Line) UV Intensity meter without UV probe: Support use of UV probes (Simple PnP) No UV probe included UV Intensity meter probe Single channel probe: 365 nm Alignment stage with precision micrometers: Alignment in X, Y and Θ with micrometer spindles Motorized Z-axis Automatic wedge compensation system for print gap control Adjustable WEC and exposure contact force EVG Aligner microscope resolution factor -2 Digital signal processing Digital zoom capabilities Standard backside alignment: Crosshair and overlay processes Top side microscope: Motorized split field microscopes for alignment in visible light Anti vibration table: Adjustable height Plate natural stone Polished with (4) pneumatic cushions Central air supply (4) Pressure regulators For mounting of earthquake protection devices CCD Cameras: Top and bottom side Objective position storage Travel range of top side microscope: X: 30 (8) -150 mm Y: -70 / +70 mm Objective: 5x Mask holder: 7" x 7" Masks with loading frame Mask contact area: Hard coated and lapped surface finish Bottom loading system with automated vacuum transfer Exposure of wafers: Round opening UNIVERSAL Wafer chuck, 6" with spacers Wafer contact area: Hard coated and lapped surface finish With windows for bottom side alignment Integrated proximity spacers for wedge error compensation in wafer Vacuum contact with substrates up to 1.5 mm thickness.
EVG / EV GROUP 620 is a mask aligner used for the placement of masks for the lithography process in semiconductor device manufacturing. The advanced, high-precision aligners are designed to increase throughput and reduce costs by optimizing alignment accuracy. EVG 620 model utilizes a high-speed, direct-drive motion equipment which allows for the positioning of the mask and wafer at speeds of up to 0.4mm/sec. This system provides high precision alignment with an accuracy of ±0.2μm during normal operation. The unit also features the latest Deep UV Multi-Channel Alignment (DUV MCTM) technology, allowing for simultaneous multilayer alignment. The alignment accuracy of EV GROUP 620 model is further maintained through its advanced alignment strategies. The Auto Alignment feature detects micro-motion errors in a matter of seconds and automatically corrects for them. The Recondition Alignment function utilizes the wafer height sensor to confirm that the alignment is done correctly, and can recalibrate the sensor machine for even greater accuracy. 620 model also benefits from a range of safety features. The clamping tool securely holds the substrate and mask during the alignment process, and a Closed-Loop Pressure Compensator adjusts to maximize throughput without sacrificing accuracy. Additionally, EVG / EV GROUP 620 includes an Energy Shield, shielding the substrate and mask during exposure for the highest standards of safety. In summary, EVG 620 model is a high-precision mask aligner designed to maximize throughput and reduce costs. It features a Direct-drive motion asset with speeds of up to 0.4mm/sec, Deep UV Multi-Channel Alignment technology, advanced alignment strategies and additional safety features, providing for the highest standards of accuracy and safety.
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