Used EVG / EV GROUP 620 #9268449 for sale

EVG / EV GROUP 620 is a state-of-the-art mask aligner designed for precision photolithography. It features advanced automation, sub-micron alignment accuracy, and a large covered area. This equipment has a 4 inch (10 cm) full-field scanner that can provide maximum throughput, enabling up to 500 procedures per hour. The patented Vertical Machine Alignment (VMA) feature ensures a flat plane even on structures with large topographical surface differences, resulting in an unprecedented direct-write and overlay performance. The system is highly modular and scalable, allowing for a range of configurations that can be tailored to the specific needs of the user. It can be operated from a simple graphical user interface, or through a network of embedded computers offering higher throughput and automation. EVG 620 has two main components: a main frame for the aligner, and a transduction electronics package to enable rapid data transfer between the unit and the upper and lower level scanners. Its actuator-based optical machine ensures fast and precise alignment of mask stamps to wafers. The tool integrates a programmable beam-scanner stage with an embedded laser interferometer asset in order to enable sub-micron alignment accuracy. EV GROUP 620 can be used to place overlay marks on masks and wafers, as well as to create direct-write layers. For the direct-write process, the model can provide variable exposure levels. It is compatible with a wide range of materials, including photoresist, oxide and nitride. The equipment is manufactured with stringent quality control standards, meeting the requirements of all major semiconductor foundries. It is a reliable and cost-effective solution for precision photolithography.